XCVU065-3FFVC1517E
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- Mfr.Part #
- XCVU065-3FFVC1517E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 520 I/O 1517FCBGA
- Stock
- 18,078
- In Stock ：
- 18,078
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Height Seated (Max) :
- 3.51mm
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Total RAM Bits :
- 45363200
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Supply Voltage :
- 1V
- Operating Temperature :
- 0°C~100°C TJ
- HTS Code :
- 8542.39.00.01
- Number of I/O :
- 520
- Width :
- 40mm
- Voltage - Supply :
- 0.970V~1.030V
- JESD-609 Code :
- e1
- Package / Case :
- 1517-BBGA, FCBGA
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- JESD-30 Code :
- S-PBGA-B1517
- Organization :
- 600 CLBS
- Mounting Type :
- Surface Mount
- ECCN Code :
- 3A001.A.7.B
- Factory Lead Time :
- 10 Weeks
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Length :
- 40mm
- Surface Mount :
- yes
- Number of LABs/CLBs :
- 44760
- Terminal Pitch :
- 1mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells :
- 783300
- Terminal Position :
- BOTTOM
- Series :
- Virtex® UltraScale™
- Number of CLBs :
- 600
- Datasheets
- XCVU065-3FFVC1517E
FPGAs AMD Xilinx XCVU065-3FFVC1517E Overview
The FPGAs AMD Xilinx XCVU065-3FFVC1517E is a high-performance integrated circuit designed by industry leader AMD Xilinx. This field-programmable gate array (FPGA) is engineered to meet the demanding needs of modern digital applications, offering a robust configuration of 520 I/Os within a compact 1517FCBGA package. Ideal for applications requiring high-speed data processing and flexibility, this FPGA allows engineers and developers to innovate and iterate designs efficiently. Its versatility and high integration capabilities make it an excellent choice for advanced system-level solutions across various industries.
XCVU065-3FFVC1517E Features
This particular model of FPGA boasts a dense array of programmable logic cells, facilitating complex digital computations and enabling the development of high-speed interfacing and processing applications. The 520 I/Os provide substantial connectivity for various peripherals and other ICs, supporting extensive design flexibility. Packaged in a 1517-ball flip-chip BGA, it ensures reduced signal integrity issues and better thermal management, crucial for maintaining reliability and performance in intensive operations.
XCVU065-3FFVC1517E Applications
- Data Centers: Utilized for managing intensive computations and data processing tasks, improving efficiency and reducing latency in server applications.
- Telecommunications: Integral in the deployment of next-generation network equipment, enhancing bandwidth and reducing energy consumption across network infrastructures.
- Automotive Systems: Used in driver assistance systems (ADAS) to process real-time data from vehicle sensors, contributing to safer driving technologies.
- Medical Imaging: Applied in the development of medical imaging devices such as MRI and CT scanners, providing the necessary computation power for high-resolution imaging and diagnostics.
- Aerospace and Defense: Key in the design of avionics and military hardware, where robustness and high-performance computing are required for mission-critical applications.
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