XCVU065-2FFVC1517I

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Mfr.Part #
XCVU065-2FFVC1517I
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 520 I/O 1517FCBGA
Stock
45,519
In Stock :
45,519

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Position :
BOTTOM
Height Seated (Max) :
3.51mm
JESD-30 Code :
S-PBGA-B1517
JESD-609 Code :
e1
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Length :
40mm
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Factory Lead Time :
10 Weeks
Published :
2012
HTS Code :
8542.39.00.01
Surface Mount :
yes
Supply Voltage :
0.95V
Operating Temperature :
-40°C~100°C TJ
ECCN Code :
3A001.A.7.B
Packaging :
Bulk
RoHS Status :
ROHS3 Compliant
Number of Logic Elements/Cells :
783300
Terminal Pitch :
1mm
Series :
Virtex® UltraScale™
Package / Case :
1517-BBGA, FCBGA
Number of I/O :
520
Number of LABs/CLBs :
44760
Organization :
600 CLBS
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Voltage - Supply :
0.922V~0.979V
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Mounting Type :
Surface Mount
Terminal Form :
Ball
Number of CLBs :
600
Width :
40mm
Total RAM Bits :
45363200
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU065-2FFVC1517I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:1517-BBGA, FCBGA, Mounting Type:Surface Mount, XCVU065-2FFVC1517I pinout, XCVU065-2FFVC1517I datasheet PDF, XCVU065-2FFVC1517I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU065-2FFVC1517I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU065-2FFVC1517I


FPGAs AMD Xilinx XCVU065-2FFVC1517I Overview

Introducing the FPGAs AMD Xilinx XCVU065-2FFVC1517I, a highly advanced IC FPGA designed to meet the evolving demands of modern digital applications. Manufactured by AMD Xilinx, this device offers robust performance and flexibility, encapsulated in a 1517FCBGA package. With 520 I/O options, it provides ample connectivity for complex digital circuits and is ideal for developers looking to push the boundaries of technology in various high-demand environments. This product is tailored to deliver exceptional reliability and performance, ensuring your projects are not only visionary but also practical and scalable.

XCVU065-2FFVC1517I Features

The XCVU065-2FFVC1517I FPGA boasts numerous features that make it a top choice for developers and engineers. Key attributes include its high I/O pin count, accommodating complex and multi-faceted designs. The FPGA is housed in a 1517FCBGA package, ensuring robust physical protection and efficient heat dissipation. This device is optimized for high-speed digital processing, making it suitable for applications requiring rapid data management and signal processing.

XCVU065-2FFVC1517I Applications

  • Data Centers: Utilized for managing extensive data flows, improving processing capabilities, and enhancing data storage solutions.
  • Telecommunications: Employs its high-speed signal processing to handle complex algorithms required in modern telecommunication infrastructure.
  • Aerospace and Defense: Ideal for applications demanding high levels of data encryption and real-time signal processing.
  • Medical Imaging: Supports the processing of large data sets quickly and efficiently, crucial for real-time imaging systems.
  • Automotive: Enhances functionality in driver assistance systems and in-vehicle infotainment systems through superior computation power.
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