XCVU9P-L2FLGA2577E

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Mfr.Part #
XCVU9P-L2FLGA2577E
Manufacturer
AMD Xilinx
Package / Case
2577-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 448 I/O 2577FCBGA
Stock
45,668
In Stock :
45,668

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Logic Elements/Cells :
2586150
Packaging :
Tray
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Voltage - Supply :
0.698V~0.742V
Number of I/O :
448
RoHS Status :
ROHS3 Compliant
Reach Compliance Code :
not_compliant
Operating Temperature :
0°C~110°C TJ
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
HTS Code :
8542.39.00.01
Package / Case :
2577-BBGA, FCBGA
Series :
Virtex® UltraScale+™
Number of LABs/CLBs :
147780
Published :
2013
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
391168000
Mounting Type :
Surface Mount
Factory Lead Time :
13 Weeks
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU9P-L2FLGA2577E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~110°C TJ, Package / Case:2577-BBGA, FCBGA, Mounting Type:Surface Mount, XCVU9P-L2FLGA2577E pinout, XCVU9P-L2FLGA2577E datasheet PDF, XCVU9P-L2FLGA2577E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU9P-L2FLGA2577E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2577-BBGA, FCBGA

XCVU9P-L2FLGA2577E Overview


As part of the 2577-BBGA, FCBGA package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 448 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 2586150 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 0.698V~0.742V . It is a type of FPGA that belongs to the Virtex® UltraScale+™ series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~110°C TJ when operating the machine. In order to save space, this FPGA model has been contained in Tray. This device has 391168000 RAM bits, which is the number of RAM bits that this device offers. The FPGA consists of 147780 LABs/CLBs.

XCVU9P-L2FLGA2577E Features


448 I/Os
Up to 391168000 RAM bits


XCVU9P-L2FLGA2577E Applications


There are a lot of Xilinx Inc.
XCVU9P-L2FLGA2577E FPGAs applications.


  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
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