XCVU9P-3FLGC2104E

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Mfr.Part #
XCVU9P-3FLGC2104E
Manufacturer
AMD Xilinx
Package / Case
2104-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 416 I/O 2104FCBGA
Stock
39,922
In Stock :
39,922

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Factory Lead Time :
13 Weeks
Series :
Virtex® UltraScale+™
HTS Code :
8542.39.00.01
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Package / Case :
2104-BBGA, FCBGA
Number of I/O :
416
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Mounting Type :
Surface Mount
Operating Temperature :
0°C~100°C TJ
Packaging :
Tray
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Voltage - Supply :
0.873V~0.927V
Total RAM Bits :
391168000
Reach Compliance Code :
not_compliant
RoHS Status :
ROHS3 Compliant
Number of Logic Elements/Cells :
2586150
Number of LABs/CLBs :
147780
Datasheets
XCVU9P-3FLGC2104E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU9P-3FLGC2104E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:2104-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, XCVU9P-3FLGC2104E pinout, XCVU9P-3FLGC2104E datasheet PDF, XCVU9P-3FLGC2104E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU9P-3FLGC2104E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA

XCVU9P-3FLGC2104E Overview


In the package 2104-BBGA, FCBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 416 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 2586150 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 0.873V~0.927V, this device operates with ease. This is a type of FPGA that is part of the Virtex® UltraScale+™ series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. Fpga electronics is worth mentioning that this device provides 391168000 bfpga electronics s of RAM. The FPGA is built as an array of 147780 latches or CLBs.

XCVU9P-3FLGC2104E Features


416 I/Os
Up to 391168000 RAM bits


XCVU9P-3FLGC2104E Applications


There are a lot of Xilinx Inc.
XCVU9P-3FLGC2104E FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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