XCVU9P-3FLGB2104E

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Mfr.Part #
XCVU9P-3FLGB2104E
Manufacturer
AMD Xilinx
Package / Case
2104-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 702 I/O 2104FCBGA
Stock
45,715
In Stock :
45,715

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Factory Lead Time :
13 Weeks
Number of LABs/CLBs :
147780
Package / Case :
2104-BBGA, FCBGA
Reach Compliance Code :
not_compliant
Operating Temperature :
0°C~100°C TJ
RoHS Status :
ROHS3 Compliant
Total RAM Bits :
391168000
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Series :
Virtex® UltraScale+™
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Packaging :
Tray
Mounting Type :
Surface Mount
Number of Logic Elements/Cells :
2586150
HTS Code :
8542.39.00.01
Voltage - Supply :
0.873V~0.927V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of I/O :
702
Datasheets
XCVU9P-3FLGB2104E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU9P-3FLGB2104E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:2104-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, Mounting Type:Surface Mount, XCVU9P-3FLGB2104E pinout, XCVU9P-3FLGB2104E datasheet PDF, XCVU9P-3FLGB2104E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU9P-3FLGB2104E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA

XCVU9P-3FLGB2104E Overview


This package is included in the 2104-BBGA, FCBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 0.873V~0.927V . An FPGA belonging to the Virtex® UltraScale+™ series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 391168000 RAM bits in terms of its RAM si391168000e. An array of 147780 LABs/CLBs is built into the FPGA.

XCVU9P-3FLGB2104E Features


702 I/Os
Up to 391168000 RAM bits


XCVU9P-3FLGB2104E Applications


There are a lot of Xilinx Inc.
XCVU9P-3FLGB2104E FPGAs applications.


  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
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