XCVU9P-1FLGC2104E

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Mfr.Part #
XCVU9P-1FLGC2104E
Manufacturer
AMD Xilinx
Package / Case
2104-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 416 I/O 2104FCBGA
Stock
25,397
In Stock :
25,397

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Series :
Virtex® UltraScale+™
Factory Lead Time :
13 Weeks
Voltage - Supply :
0.825V~0.876V
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
Operating Temperature :
0°C~100°C TJ
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Reach Compliance Code :
not_compliant
Total RAM Bits :
391168000
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Package / Case :
2104-BBGA, FCBGA
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Packaging :
Tray
Number of LABs/CLBs :
147780
Number of Logic Elements/Cells :
2586150
RoHS Status :
ROHS3 Compliant
Number of I/O :
416
Datasheets
XCVU9P-1FLGC2104E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU9P-1FLGC2104E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, Package / Case:2104-BBGA, FCBGA, XCVU9P-1FLGC2104E pinout, XCVU9P-1FLGC2104E datasheet PDF, XCVU9P-1FLGC2104E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU9P-1FLGC2104E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA

XCVU9P-1FLGC2104E Overview


In the 2104-BBGA, FCBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 416 I/O ports for more coherent data transfer. To form a fundamental building block, there are 2586150 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.825V~0.876V-volt supply voltage required for the device to operate. The Virtex® UltraScale+™ Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within 0°C~100°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 391168000 bFpga chipss. A total of 147780 LABs/CLBs are included in this FPGA.

XCVU9P-1FLGC2104E Features


416 I/Os
Up to 391168000 RAM bits


XCVU9P-1FLGC2104E Applications


There are a lot of Xilinx Inc.
XCVU9P-1FLGC2104E FPGAs applications.


  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
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