XCVU57P-3FSVK2892E

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Mfr.Part #
XCVU57P-3FSVK2892E
Manufacturer
AMD Xilinx
Package / Case
2892-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA VIRTEX-UP 2892BGA
Stock
29,383
In Stock :
29,383

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
74344038
Package / Case :
2892-BBGA, FCBGA
Number of I/O :
624
Series :
Virtex® UltraScale+™
Number of LABs/CLBs :
162960
Supplier Device Package :
2892-FCBGA (55x55)
Operating Temperature :
0°C ~ 100°C (TJ)
Product Status :
Active
Number of Logic Elements/Cells :
2851800
Mounting Type :
Surface Mount
Package :
Tray
Voltage - Supply :
0.873V ~ 0.927V
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU57P-3FSVK2892E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:2892-BBGA, FCBGA, Operating Temperature:0°C ~ 100°C (TJ), Mounting Type:Surface Mount, XCVU57P-3FSVK2892E pinout, XCVU57P-3FSVK2892E datasheet PDF, XCVU57P-3FSVK2892E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU57P-3FSVK2892E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU57P-3FSVK2892E


FPGAs AMD Xilinx XCVU57P-3FSVK2892E Overview

Introducing the FPGAs AMD Xilinx XCVU57P-3FSVK2892E, a state-of-the-art integrated circuit designed for high-performance applications that demand superior processing power and flexibility. Manufactured by AMD Xilinx, this FPGA features the VIRTEX UltraScale+ architecture, housed in a 2892-pin BGA (ball grid array) package. The device is optimized for next-generation hardware acceleration and is capable of handling complex, multi-threaded applications that are critical in today's technology landscape. This product's advanced capabilities make it an ideal choice for developers looking to push the boundaries of connectivity, speed, and computational efficiency.

XCVU57P-3FSVK2892E Features

The XCVU57P-3FSVK2892E FPGA is packed with features that enhance its performance and usability. Key features include high-integration capability, low power consumption, and robust security options. The FPGA supports a variety of high-speed data transmission standards and is designed for easy scalability, ensuring it can adapt to both current and future technological advancements. Its enhanced programmable logic elements and interconnect technology enable superior customization and speed in processing complex algorithms and high-throughput tasks.

XCVU57P-3FSVK2892E Applications

  • Data Centers: Enhances processing capabilities in servers and storage solutions, allowing for efficient data management and high-speed data processing.
  • Network Infrastructure: Critical in the development of network equipment such as routers and switches, ensuring fast and reliable data transmission.
  • 5G Technology: Plays a vital role in the rollout of 5G networks by supporting the complex digital signal processing required for 5G base stations.
  • Artificial Intelligence: Provides the necessary computational power to handle AI algorithms, especially in machine learning and deep learning applications.
  • Automotive: Used in advanced driver-assistance systems (ADAS) to process real-time inputs from multiple sensors, enhancing vehicle safety and functionality.
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