XCVU47P-3FSVH2892E

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Mfr.Part #
XCVU47P-3FSVH2892E
Manufacturer
AMD Xilinx
Package / Case
2892-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 624 I/O 2892FCBGA
Stock
46,556
In Stock :
46,556

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
2892-BBGA, FCBGA
Factory Lead Time :
11 Weeks
Mounting Type :
Surface Mount
Operating Temperature :
0°C~100°C TJ
Total RAM Bits :
74344038
Number of I/O :
624
Series :
Virtex® UltraScale+™
Number of Logic Elements/Cells :
2851800
Voltage - Supply :
0.825V~0.876V
Number of LABs/CLBs :
162960
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU47P-3FSVH2892E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:2892-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, XCVU47P-3FSVH2892E pinout, XCVU47P-3FSVH2892E datasheet PDF, XCVU47P-3FSVH2892E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU47P-3FSVH2892E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU47P-3FSVH2892E


FPGAs AMD Xilinx XCVU47P-3FSVH2892E Overview

The FPGAs AMD Xilinx XCVU47P-3FSVH2892E is a highly capable integrated circuit specifically designed for advanced applications that require high-speed, flexible logic customization and substantial I/O capabilities. This FPGA is manufactured by AMD Xilinx, a leader in programmable logic solutions, ensuring top-notch reliability and performance. The device features 624 I/O ports housed in a 2892-ball flip-chip ball grid array (FCBGA) package, making it an ideal choice for intricate designs that require a high degree of connectivity and complex signal processing capabilities. The XCVU47P-3FSVH2892E is engineered to meet the demanding needs of modern digital systems where flexibility, scalability, and performance are crucial.

XCVU47P-3FSVH2892E Features

This state-of-the-art FPGA offers a multitude of features that make it suitable for a wide range of applications. These include an advanced high-performance logic structure for increased efficiency and speed, a large number of I/O ports for enhanced connectivity, and a robust package design optimized for heat dissipation and size reduction. The XCVU47P-3FSVH2892E also supports multiple configurable logic blocks, adaptive computing acceleration capabilities, and integrated DSP slices for efficient processing and manipulation of complex digital signals.

XCVU47P-3FSVH2892E Applications

  • Data Centers: Utilized in high-speed server applications, facilitating accelerated data processing and efficient handling of large-scale cloud computing tasks.
  • Networking: Essential in the development of routers and switches, providing the necessary logic and processing power to manage large volumes of network traffic efficiently.
  • Telecommunications: Deployed in telecommunications infrastructure, enhancing capabilities in signal processing and real-time data transmission.
  • Medical Imaging: Applied in advanced medical imaging systems, where its processing power helps in the quick rendering and manipulation of complex imaging data.
  • Automotive: Used in automotive applications, particularly in driver assistance systems and in-vehicle infotainment systems, offering robust performance and connectivity.
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