XCVU45P-3FSVH2892E

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Mfr.Part #
XCVU45P-3FSVH2892E
Manufacturer
AMD Xilinx
Package / Case
2892-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 416 I/O 2892FCBGA
Stock
20,721
In Stock :
20,721

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
Total RAM Bits :
49597645
Voltage - Supply :
0.825V~0.876V
Number of LABs/CLBs :
108960
Number of I/O :
416
Package / Case :
2892-BBGA, FCBGA
Series :
Virtex® UltraScale+™
Number of Logic Elements/Cells :
1906800
Factory Lead Time :
11 Weeks
Operating Temperature :
0°C~100°C TJ
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU45P-3FSVH2892E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:2892-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, XCVU45P-3FSVH2892E pinout, XCVU45P-3FSVH2892E datasheet PDF, XCVU45P-3FSVH2892E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU45P-3FSVH2892E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU45P-3FSVH2892E


FPGAs AMD Xilinx XCVU45P-3FSVH2892E Overview

The FPGAs AMD Xilinx XCVU45P-3FSVH2892E represents a cutting-edge solution in programmable logic technology, engineered by AMD Xilinx, a leader in the industry. This high-performance FPGA is encapsulated in a 2892-pin FCBGA (Flip Chip Ball Grid Array) package, offering robust support for a wide array of digital and mixed-signal applications. It is especially designed to meet the rigorous demands of high-throughput systems, featuring an impressive array of 416 I/Os that facilitate versatile and scalable hardware interfacing, making it an ideal choice for developers aiming to push the limits of computational power and efficiency in complex, multi-functional devices.

XCVU45P-3FSVH2892E Features

This FPGA model from AMD Xilinx offers an exceptional feature set that includes advanced signal processing capabilities, substantial logic density, and flexible on-chip resources. These features support high-speed data processing and are crucial for implementing multi-rate communication systems and complex digital processing tasks. The device's scalable design allows for extensive customization, enabling developers to tailor solutions specific to their application requirements while maintaining a high degree of system integration.

XCVU45P-3FSVH2892E Applications

  • Data Centers: Utilizes its high I/O count and processing power to manage and accelerate data-intensive tasks, improving operational efficiency and throughput in server farms and storage networks.
  • Telecommunications: Supports advanced communication protocols, aiding in the development of high-speed networking equipment like routers and base stations, critical for 5G implementations.
  • Automotive Technology: Applied in driver assistance systems (ADAS), where its processing capabilities help in real-time decision making and sensor data integration, enhancing vehicle safety and functionality.
  • Aerospace and Defense: Used in avionics for both commercial and military applications, where robustness and the ability to perform multiple concurrent tasks are paramount.
  • Industrial Automation: Empowers sophisticated control systems, providing the backbone for robotics and complex automation processes, leading to increased productivity and reliability in manufacturing environments.
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