XCVU3P-L2FFVC1517E

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Mfr.Part #
XCVU3P-L2FFVC1517E
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 520 I/O 1517FCBGA
Stock
7,130
In Stock :
7,130

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
0.698V~0.742V
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Factory Lead Time :
11 Weeks
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of Logic Elements/Cells :
862050
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
HTS Code :
8542.39.00.01
Number of I/O :
520
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Operating Temperature :
0°C~110°C TJ
Total RAM Bits :
130355200
Packaging :
Tray
Package / Case :
1517-BBGA, FCBGA
Number of LABs/CLBs :
49260
Series :
Virtex® UltraScale+™
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU3P-L2FFVC1517E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~110°C TJ, Package / Case:1517-BBGA, FCBGA, XCVU3P-L2FFVC1517E pinout, XCVU3P-L2FFVC1517E datasheet PDF, XCVU3P-L2FFVC1517E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU3P-L2FFVC1517E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU3P-L2FFVC1517E


FPGAs AMD Xilinx XCVU3P-L2FFVC1517E Overview

The FPGAs AMD Xilinx XCVU3P-L2FFVC1517E is a high-performance integrated circuit designed to meet the rigorous demands of modern digital processing. Engineered by AMD Xilinx, a leader in digital circuit technology, this FPGA boasts a versatile 1517FCBGA package, making it ideal for advanced applications that require robust I/O capabilities and flexible configuration. Its ability to handle up to 520 I/O points provides exceptional utility in complex digital environments. This product stands out for its integration capabilities, offering an optimal solution for designers seeking top-tier performance and configurability.

XCVU3P-L2FFVC1517E Features

The XCVU3P-L2FFVC1517E from AMD Xilinx offers a comprehensive set of features that enhance its application across various industries. The device's large number of I/O ports, combined with a flexible ball grid array (BGA) packaging, ensures easy integration into existing technology stacks and systems. Additionally, its advanced FPGA architecture supports high-speed data processing, making it an ideal choice for projects requiring rapid data handling and processing capabilities.

XCVU3P-L2FFVC1517E Applications

  • Telecommunications: Utilized in network infrastructure to manage signal processing and data flow efficiently, enhancing communications reliability and speed.
  • Data Centers: Plays a critical role in accelerating computing tasks and managing workloads in server farms, optimizing operational efficiency and energy usage.
  • Automotive: Integrated into driver-assistance systems to process real-time data from sensors, improving vehicle safety and performance.
  • Medical Devices: Employs in advanced medical imaging systems, enabling rapid processing of complex visual data for quicker diagnostics.
  • Aerospace: Essential for navigation and control systems, where its ability to perform multiple computations simultaneously ensures system reliability in critical missions.
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