XCVU3P-L2FFVC1517E
- Mfr.Part #
- XCVU3P-L2FFVC1517E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 520 I/O 1517FCBGA
- Stock
- 7,130
- In Stock :
- 7,130
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Voltage - Supply :
- 0.698V~0.742V
- RoHS Status :
- ROHS3 Compliant
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 11 Weeks
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Logic Elements/Cells :
- 862050
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- HTS Code :
- 8542.39.00.01
- Number of I/O :
- 520
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Operating Temperature :
- 0°C~110°C TJ
- Total RAM Bits :
- 130355200
- Packaging :
- Tray
- Package / Case :
- 1517-BBGA, FCBGA
- Number of LABs/CLBs :
- 49260
- Series :
- Virtex® UltraScale+™
- Datasheets
- XCVU3P-L2FFVC1517E

FPGAs AMD Xilinx XCVU3P-L2FFVC1517E Overview
The FPGAs AMD Xilinx XCVU3P-L2FFVC1517E is a high-performance integrated circuit designed to meet the rigorous demands of modern digital processing. Engineered by AMD Xilinx, a leader in digital circuit technology, this FPGA boasts a versatile 1517FCBGA package, making it ideal for advanced applications that require robust I/O capabilities and flexible configuration. Its ability to handle up to 520 I/O points provides exceptional utility in complex digital environments. This product stands out for its integration capabilities, offering an optimal solution for designers seeking top-tier performance and configurability.
XCVU3P-L2FFVC1517E Features
The XCVU3P-L2FFVC1517E from AMD Xilinx offers a comprehensive set of features that enhance its application across various industries. The device's large number of I/O ports, combined with a flexible ball grid array (BGA) packaging, ensures easy integration into existing technology stacks and systems. Additionally, its advanced FPGA architecture supports high-speed data processing, making it an ideal choice for projects requiring rapid data handling and processing capabilities.
XCVU3P-L2FFVC1517E Applications
- Telecommunications: Utilized in network infrastructure to manage signal processing and data flow efficiently, enhancing communications reliability and speed.
- Data Centers: Plays a critical role in accelerating computing tasks and managing workloads in server farms, optimizing operational efficiency and energy usage.
- Automotive: Integrated into driver-assistance systems to process real-time data from sensors, improving vehicle safety and performance.
- Medical Devices: Employs in advanced medical imaging systems, enabling rapid processing of complex visual data for quicker diagnostics.
- Aerospace: Essential for navigation and control systems, where its ability to perform multiple computations simultaneously ensures system reliability in critical missions.
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