XCVU3P-2FFVC1517I
- Mfr.Part #
- XCVU3P-2FFVC1517I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 520 I/O 1517FCBGA
- Stock
- 257
- In Stock :
- 257
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Operating Temperature :
- -40°C~100°C TJ
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Voltage - Supply :
- 0.825V~0.876V
- Total RAM Bits :
- 118067200
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 49260
- Packaging :
- Tray
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Series :
- Virtex® UltraScale+™
- RoHS Status :
- ROHS3 Compliant
- Number of I/O :
- 520
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 11 Weeks
- Package / Case :
- 1517-BBGA, FCBGA
- HTS Code :
- 8542.39.00.01
- Number of Logic Elements/Cells :
- 862050
- Datasheets
- XCVU3P-2FFVC1517I

FPGAs AMD Xilinx XCVU3P-2FFVC1517I Overview
The AMD Xilinx XCVU3P-2FFVC1517I represents a state-of-the-art solution in the field of FPGAs (Field Programmable Gate Array), designed to deliver unparalleled flexibility and performance. This highly advanced IC FPGA features a robust 1517FCBGA package, making it an ideal choice for developers looking for scalable solutions in high-demand applications. Its ability to handle 520 I/Os allows for extensive interfacing with a wide range of peripherals and other digital systems, ensuring that it meets the rigorous demands of modern technology infrastructures. The integration of this FPGA into your systems means access to superior computational power and adaptability, key for industries requiring high-speed data processing and customizable logic configurations.
XCVU3P-2FFVC1517I Features
This advanced FPGA from AMD Xilinx is packed with features designed for efficiency and high performance. The unit’s 520 I/O capabilities provide ample room for integration into complex designs, while the 1517 pin count in a FCBGA (Flip-Chip Ball Grid Array) package ensures robust, reliable connections and enhanced heat dissipation. This FPGA is specifically tailored for intensive computation tasks and can significantly streamline the development process across various technological sectors.
XCVU3P-2FFVC1517I Applications
- Data Centers: Utilized for managing massive data flows, this FPGA enhances processing capabilities and bandwidth, ensuring reliable, swift data handling and improved server functionality.
- Telecommunications: Essential for the development of telecommunications infrastructure, the XCVU3P-2FFVC1517I supports advanced digital signal processing which is critical for high-speed data transmission and signal integrity.
- Automotive Technology: Applied in driver assistance systems, this FPGA can process multiple inputs from various sensors simultaneously, enhancing the vehicle's response systems and safety features.
- Aerospace and Defense: This FPGA is capable of performing in extreme environments, providing reliable performance for navigation systems, flight control systems, and other critical aerospace components.
- Video Processing: Ideal for real-time video processing applications, it supports high-resolution video applications, allowing for enhanced video capturing, editing, and broadcasting capabilities.
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