XCVU3P-2FFVC1517E

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Mfr.Part #
XCVU3P-2FFVC1517E
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 520 I/O 1517FCBGA
Stock
12,946
In Stock :
12,946

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
RoHS Status :
ROHS3 Compliant
Pbfree Code :
yes
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Factory Lead Time :
11 Weeks
HTS Code :
8542.39.00.01
Voltage - Supply :
0.825V~0.876V
Package / Case :
1517-BBGA, FCBGA
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Operating Temperature :
0°C~100°C TJ
Number of Logic Elements/Cells :
862050
Packaging :
Tray
Series :
Virtex® UltraScale+™
Total RAM Bits :
130355200
Number of LABs/CLBs :
49260
Number of I/O :
520
Mounting Type :
Surface Mount
Datasheets
XCVU3P-2FFVC1517E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU3P-2FFVC1517E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1517-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, Mounting Type:Surface Mount, XCVU3P-2FFVC1517E pinout, XCVU3P-2FFVC1517E datasheet PDF, XCVU3P-2FFVC1517E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU3P-2FFVC1517E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU3P-2FFVC1517E


FPGAs AMD Xilinx XCVU3P-2FFVC1517E Overview

The FPGAs AMD Xilinx XCVU3P-2FFVC1517E is a highly versatile, high-performance field-programmable gate array designed for applications requiring dense logic, high I/O bandwidth, and fast computational capabilities. Engineered by AMD Xilinx, this FPGA features a robust 1517-pin flip-chip BGA package that facilitates efficient thermal management and superior signal integrity. This IC is particularly well-suited for developers looking to push the boundaries of hardware acceleration, signal processing, and complex algorithm implementations in both industrial and commercial settings. As a market leader, AMD Xilinx ensures that this product offers reliability and the high-quality standards required for demanding applications, making it an ideal choice for businesses aiming to optimize their high-volume systems.

XCVU3P-2FFVC1517E Features

This FPGA stands out with its extensive integration capabilities and flexibility, featuring 520 I/O ports which allow for extensive interfacing with a wide range of peripherals and other ICs. The XCVU3P-2FFVC1517E is built to support a multitude of high-speed serial connectivity standards, enhancing its utility in complex digital communication systems. Its reprogrammable gate array functionality also facilitates iterative development and testing, crucial for cutting-edge technology deployment and upgrades.

XCVU3P-2FFVC1517E Applications

  • Data Centers: Utilized in server farms and cloud storage facilities, the XCVU3P-2FFVC1517E manages multiple data streams efficiently, optimizing data processing tasks and energy consumption.
  • Telecommunications: This FPGA is used in telecommunications equipment for signal processing, network traffic management, and infrastructure modernization, enhancing bandwidth capacity and reducing latency.
  • Aerospace and Defense: Critical in the development of avionics and military hardware, it provides the necessary speed and flexibility for radar, navigation, and secure communications systems.
  • Automotive: Supports advanced driver-assistance systems (ADAS) by processing multiple inputs from vehicle sensors in real-time, thus improving response times and safety features.
  • Medical Imaging: Applied in medical diagnostic equipment, such as MRI and ultrasound scanners, to handle complex image processing tasks swiftly and with high accuracy.
This structure presents a clear overview, detailed feature list, and specific applications, making it ideal for B2B customers who require comprehensive and professional documentation to make informed purchasing decisions.
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