XCVU3P-1FFVC1517E

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Mfr.Part #
XCVU3P-1FFVC1517E
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 520 I/O 1517FCBGA
Stock
31,414
In Stock :
31,414

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Factory Lead Time :
11 Weeks
Package / Case :
1517-BBGA, FCBGA
Number of LABs/CLBs :
49260
RoHS Status :
ROHS3 Compliant
Operating Temperature :
0°C~100°C TJ
HTS Code :
8542.39.00.01
Voltage - Supply :
0.825V~0.876V
Total RAM Bits :
130355200
Number of Logic Elements/Cells :
862050
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Packaging :
Tray
Mounting Type :
Surface Mount
Number of I/O :
520
Series :
Virtex® UltraScale+™
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Datasheets
XCVU3P-1FFVC1517E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU3P-1FFVC1517E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1517-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, Mounting Type:Surface Mount, XCVU3P-1FFVC1517E pinout, XCVU3P-1FFVC1517E datasheet PDF, XCVU3P-1FFVC1517E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU3P-1FFVC1517E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU3P-1FFVC1517E


FPGAs AMD Xilinx XCVU3P-1FFVC1517E Overview

The FPGAs AMD Xilinx XCVU3P-1FFVC1517E is a cutting-edge Field Programmable Gate Array (FPGA) designed for high-performance applications requiring significant processing power and high I/O throughput. Manufactured by AMD Xilinx, this FPGA is encapsulated in a 1517-pin Flip-Chip Ball Grid Array (FCBGA) package, making it ideal for compact and complex digital environments. With 520 I/O options, it provides exceptional flexibility and scalability for system designers, allowing for a wide range of application deployments. This FPGA is specifically tailored to meet the demanding needs of modern digital circuits, providing robust support for sophisticated logic operations and data processing tasks.

XCVU3P-1FFVC1517E Features

This advanced FPGA offers a host of features designed to enhance its efficiency and functionality in complex electronic environments. Key features include its high I/O count, extensive support for multiple logic configurations, and compatibility with AMD Xilinx’s Vivado Design Suite for streamlined development and debugging. Moreover, its 1517FCBGA packaging ensures high-density integration while allowing for excellent thermal management and reliability under varied operational conditions.

XCVU3P-1FFVC1517E Applications

  • Data Centers: Utilized in server infrastructure to accelerate data processing tasks, enhancing performance and efficiency in handling large-scale data operations.
  • Telecommunications: Deployed in telecommunications equipment for signal processing, supporting high-speed data transmission and reliable connectivity across networks.
  • Automotive: Integral in advanced driver-assistance systems (ADAS), providing the necessary computational power to process real-time data from vehicle sensors for enhanced safety features.
  • Medical Devices: Used in medical imaging systems, where its high processing capabilities help in the rapid and accurate generation of medical imaging data, thus improving diagnostic procedures.
  • Aerospace and Defense: Applied in avionics for navigation and control systems, offering robust performance in critical applications that require high reliability and precision.
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