XCVU33P-L2FSVH2104E
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- Mfr.Part #
- XCVU33P-L2FSVH2104E
- Manufacturer
- AMD Xilinx
- Package / Case
- 2104-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 208 I/O 2104FCBGA
- Stock
- 43,259
- In Stock ：
- 43,259
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Series :
- Virtex® UltraScale+™
- Total RAM Bits :
- 24746394
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Logic Elements/Cells :
- 961800
- Operating Temperature :
- 0°C~100°C TJ
- Factory Lead Time :
- 11 Weeks
- Number of LABs/CLBs :
- 54960
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Package / Case :
- 2104-BBGA, FCBGA
- Voltage - Supply :
- 0.698V~0.742V
- Number of I/O :
- 208
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Datasheets
- XCVU33P-L2FSVH2104E
FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA
XCVU33P-L2FSVH2104E Overview
In the package 2104-BBGA, FCBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 208 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 961800 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 0.698V~0.742V, this device operates with ease. This is a type of FPGA that is part of the Virtex® UltraScale+™ series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. Fpga electronics is worth mentioning that this device provides 24746394 bfpga electronics s of RAM. The FPGA is built as an array of 54960 latches or CLBs.
XCVU33P-L2FSVH2104E Features
208 I/Os
Up to 24746394 RAM bits
XCVU33P-L2FSVH2104E Applications
There are a lot of Xilinx Inc.
XCVU33P-L2FSVH2104E FPGAs applications.
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
- Distributed Monetary Systems
- Data Center
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