XCVU23P-L2FSVJ1760E
- Mfr.Part #
- XCVU23P-L2FSVJ1760E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA VIRTEX-UP LP 1760FCBGA
- Stock
- 15,846
- In Stock :
- 15,846
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of LABs/CLBs :
- 128700
- Mounting Type :
- Surface Mount
- Number of I/O :
- 644
- Product Type :
- General Purpose Relays
- Subcategory :
- Relays
- Minimum Operating Temperature :
- 0 C
- Product Status :
- Active
- Number of Logic Elements/Cells :
- 2252250
- Supplier Device Package :
- 1760-FCBGA (42.5x42.5)
- Tradename :
- Virtex UltraScale+
- Brand :
- TE Connectivity
- Series :
- V23061
- Operating Temperature :
- 0°C ~ 110°C (TJ)
- Voltage - Supply :
- 0.698V ~ 0.742V
- Product Category :
- General Purpose Relays
- Product :
- Power Relays
- Package :
- Tray
- Package / Case :
- 1760-BBGA, FCBGA
- Maximum Operating Temperature :
- + 110 C
- Total RAM Bits :
- 77909197
- Manufacturer :
- TE Connectivity
- Datasheets
- XCVU23P-L2FSVJ1760E

FPGAs AMD Xilinx XCVU23P-L2FSVJ1760E Overview
Introducing the cutting-edge FPGAs AMD Xilinx XCVU23P-L2FSVJ1760E, a high-performance integrated circuit designed to meet the complex demands of modern digital processing. This IC FPGA from AMD Xilinx, embedded in a compact 1760-pin FCBGA package, ensures optimal functionality with its advanced Virtex UltraScale+ architecture. Tailored for applications requiring high-speed data processing and significant logic density, this device is a staple in the development of scalable, efficient, and high-speed computing solutions. The use of the FPGas AMD Xilinx XCVU23P-L2FSVJ1760E in your projects ensures robust performance and adaptability, driving innovation in various technological fields.
XCVU23P-L2FSVJ1760E Features
The XCVU23P-L2FSVJ1760E FPGA boasts numerous features that make it a superior choice for developers and engineers. It incorporates a high logic density, extensive I/O capabilities, and advanced DSP slices conducive to efficient signal processing. Its compatibility with multi-gigabit transceivers enhances its application in high-speed data environments, while the adaptive clocking system and power management options ensure efficient operation under varying conditions.
XCVU23P-L2FSVJ1760E Applications
- Data Centers: Utilized for accelerating computing processes, managing large-scale data operations, and improving server efficiency.
- Telecommunications: Supports infrastructure for high-speed communication networks, enhancing data transmission capabilities and network reliability.
- Aerospace and Defense: Critical for applications requiring high levels of data encryption and real-time processing in secure communications and control systems.
- Medical Imaging: Integral in the processing and analysis of complex imaging data, contributing to advanced diagnostics and research.
- Automotive: Helps in the development of advanced driver-assistance systems (ADAS) by processing multiple real-time inputs for vehicle safety and automation.
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