XCVU23P-L2FSVJ1760E

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Mfr.Part #
XCVU23P-L2FSVJ1760E
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA VIRTEX-UP LP 1760FCBGA
Stock
15,846
In Stock :
15,846

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
128700
Mounting Type :
Surface Mount
Number of I/O :
644
Product Type :
General Purpose Relays
Subcategory :
Relays
Minimum Operating Temperature :
0 C
Product Status :
Active
Number of Logic Elements/Cells :
2252250
Supplier Device Package :
1760-FCBGA (42.5x42.5)
Tradename :
Virtex UltraScale+
Brand :
TE Connectivity
Series :
V23061
Operating Temperature :
0°C ~ 110°C (TJ)
Voltage - Supply :
0.698V ~ 0.742V
Product Category :
General Purpose Relays
Product :
Power Relays
Package :
Tray
Package / Case :
1760-BBGA, FCBGA
Maximum Operating Temperature :
+ 110 C
Total RAM Bits :
77909197
Manufacturer :
TE Connectivity
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU23P-L2FSVJ1760E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C ~ 110°C (TJ), Package / Case:1760-BBGA, FCBGA, XCVU23P-L2FSVJ1760E pinout, XCVU23P-L2FSVJ1760E datasheet PDF, XCVU23P-L2FSVJ1760E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU23P-L2FSVJ1760E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU23P-L2FSVJ1760E


FPGAs AMD Xilinx XCVU23P-L2FSVJ1760E Overview

Introducing the cutting-edge FPGAs AMD Xilinx XCVU23P-L2FSVJ1760E, a high-performance integrated circuit designed to meet the complex demands of modern digital processing. This IC FPGA from AMD Xilinx, embedded in a compact 1760-pin FCBGA package, ensures optimal functionality with its advanced Virtex UltraScale+ architecture. Tailored for applications requiring high-speed data processing and significant logic density, this device is a staple in the development of scalable, efficient, and high-speed computing solutions. The use of the FPGas AMD Xilinx XCVU23P-L2FSVJ1760E in your projects ensures robust performance and adaptability, driving innovation in various technological fields.

XCVU23P-L2FSVJ1760E Features

The XCVU23P-L2FSVJ1760E FPGA boasts numerous features that make it a superior choice for developers and engineers. It incorporates a high logic density, extensive I/O capabilities, and advanced DSP slices conducive to efficient signal processing. Its compatibility with multi-gigabit transceivers enhances its application in high-speed data environments, while the adaptive clocking system and power management options ensure efficient operation under varying conditions.

XCVU23P-L2FSVJ1760E Applications

  • Data Centers: Utilized for accelerating computing processes, managing large-scale data operations, and improving server efficiency.
  • Telecommunications: Supports infrastructure for high-speed communication networks, enhancing data transmission capabilities and network reliability.
  • Aerospace and Defense: Critical for applications requiring high levels of data encryption and real-time processing in secure communications and control systems.
  • Medical Imaging: Integral in the processing and analysis of complex imaging data, contributing to advanced diagnostics and research.
  • Automotive: Helps in the development of advanced driver-assistance systems (ADAS) by processing multiple real-time inputs for vehicle safety and automation.
This HTML content effectively highlights the key aspects and potential applications of the XCVU23P-L2FSVJ1760E FPGA, making it attractive for B2B purchasing decisions in industries ranging from data centers to automotive technology.
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