XCVU23P-3FSVJ1760E

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Mfr.Part #
XCVU23P-3FSVJ1760E
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA VIRTEX-UP 1760FCBGA
Stock
49,656
In Stock :
49,656

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Product Status :
Active
Voltage - Supply :
0.873V ~ 0.927V
Operating Temperature :
0°C ~ 100°C (TJ)
Total RAM Bits :
77909197
Package :
Tray
Number of LABs/CLBs :
128700
Number of Logic Elements/Cells :
2252250
Package / Case :
1760-BBGA, FCBGA
Number of I/O :
644
Mounting Type :
Surface Mount
Supplier Device Package :
1760-FCBGA (42.5x42.5)
Series :
Virtex® UltraScale+™
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU23P-3FSVJ1760E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C ~ 100°C (TJ), Package / Case:1760-BBGA, FCBGA, Mounting Type:Surface Mount, XCVU23P-3FSVJ1760E pinout, XCVU23P-3FSVJ1760E datasheet PDF, XCVU23P-3FSVJ1760E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU23P-3FSVJ1760E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU23P-3FSVJ1760E


FPGAs AMD Xilinx XCVU23P-3FSVJ1760E Overview

Introducing the FPGAs AMD Xilinx XCVU23P-3FSVJ1760E, a cutting-edge field-programmable gate array (FPGA) designed for optimal performance and flexibility in high-demand applications. Manufactured by the renowned AMD Xilinx, this FPGA leverages advanced technology to deliver exceptional computational power and configurability. The XCVU23P-3FSVJ1760E is housed in a 1760-pin flip-chip ball grid array (FCBGA) package, ensuring robust connectivity and reliability for intensive operations. Ideal for developers looking to push the boundaries of technology, this product offers a scalable solution that meets both current and future system requirements.

XCVU23P-3FSVJ1760E Features

The XCVU23P-3FSVJ1760E is equipped with a multitude of features designed to enhance its efficiency and utility in complex digital environments. Its high integration capability allows for significant reductions in power consumption and board space, making it a preferred choice for eco-efficient designs. Additionally, the FPGA supports a wide range of I/O protocols, ensuring versatile connectivity for various electronic components and systems.

XCVU23P-3FSVJ1760E Applications

  • Data Centers: This FPGA excels in managing and accelerating data processing tasks, optimizing server capabilities and cloud computing operations.
  • Telecommunications: Employed in infrastructure to enhance signal processing functions, network reliability, and support for emerging 5G technologies.
  • Aerospace and Defense: Utilized in applications requiring high levels of security and computational power, including satellite communications and radar systems.
  • Medical Imaging: Plays a critical role in processing complex imaging data rapidly and with high accuracy, essential for diagnostic equipment such as MRI and CT scanners.
  • Automotive: Enhances the capability of advanced driver-assistance systems (ADAS) through rapid processing of sensor data for real-time decision making.
This HTML content structurally organizes the product description into three clear sections under specified headings, using an engaging, informative tone to attract B2B customers and effectively highlight the FPGA's diverse applications.
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