XCVU23P-2VSVA1365E

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Mfr.Part #
XCVU23P-2VSVA1365E
Manufacturer
AMD Xilinx
Package / Case
1365-BFBGA, FCBGA
Datasheet
Download
Description
IC FPGA VIRTEX-UP 1365FCBGA
Stock
33,695
In Stock :
33,695

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of I/O :
364
Product Status :
Active
Package :
Tray
Mounting Type :
Surface Mount
Supplier Device Package :
1365-FCBGA (35x35)
Series :
Virtex® UltraScale+™
Total RAM Bits :
77909197
Package / Case :
1365-BFBGA, FCBGA
Voltage - Supply :
0.825V ~ 0.876V
Number of Logic Elements/Cells :
2252250
Number of LABs/CLBs :
128700
Operating Temperature :
0°C ~ 100°C (TJ)
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU23P-2VSVA1365E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:1365-BFBGA, FCBGA, Operating Temperature:0°C ~ 100°C (TJ), XCVU23P-2VSVA1365E pinout, XCVU23P-2VSVA1365E datasheet PDF, XCVU23P-2VSVA1365E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU23P-2VSVA1365E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU23P-2VSVA1365E


FPGAs AMD Xilinx XCVU23P-2VSVA1365E Overview

Introducing the FPGAs AMD Xilinx XCVU23P-2VSVA1365E, a leading-edge field-programmable gate array designed to deliver exceptional performance and flexibility. This advanced IC FPGA is part of the Virtex UltraScale+ series and comes packaged in a 1365-pin FCBGA, making it ideal for demanding applications that require high-speed data processing and significant logic density. The XCVU23P-2VSVA1365E is engineered to meet the challenging demands of high-throughput systems, offering a robust solution for developers aiming to accelerate their applications with customizable logic options.

XCVU23P-2VSVA1365E Features

The XCVU23P-2VSVA1365E FPGA from AMD Xilinx boasts an array of features designed for optimum performance in high-tech environments. Key attributes include advanced signal processing capabilities, high-density logic integration, and superior I/O bandwidth. This component ensures lower power consumption while maximizing reliability and efficiency in complex, multi-functional systems.

XCVU23P-2VSVA1365E Applications

  • Data Centers: Utilized in server farms to speed up data processing tasks through customizable hardware acceleration, enhancing efficiency and performance.
  • 5G Technology: Plays a critical role in base stations for 5G networks, facilitating rapid data throughput and real-time signal processing to meet the demands of next-generation communications.
  • Artificial Intelligence: Supports AI applications by providing the necessary computational power and speed to handle complex algorithms and neural network processing.
  • Aerospace and Defense: Employed in satellite communications and radar systems, offering the robustness and high-level processing required for critical defense mechanisms.
  • Medical Imaging: Integral in advanced medical imaging systems, enabling fast processing of large datasets necessary for high-resolution imaging techniques.
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