XCVU23P-2FSVJ1760E
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- Mfr.Part #
- XCVU23P-2FSVJ1760E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA VIRTEX-UP 1760FCBGA
- Stock
- 14,743
- In Stock ：
- 14,743
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Voltage Rating :
- 150 V
- Temperature Coefficient :
- 50 ppm/°C
- Operating Temperature :
- 0°C ~ 100°C (TJ)
- Min Operating Temperature :
- -55 °C
- Series :
- Virtex® UltraScale+™
- Resistance :
- 226 Ω
- Product Status :
- Active
- Number of I/O :
- 644
- Package / Case :
- 1760-BBGA, FCBGA
- Number of Logic Elements/Cells :
- 2252250
- RoHS :
- Compliant
- Composition :
- Thin Film
- Lead Free :
- Lead Free
- Mounting Type :
- Surface Mount
- Number of LABs/CLBs :
- 128700
- Voltage - Supply :
- 0.825V ~ 0.876V
- Package :
- Tray
- Height :
- 550 µm
- Power Rating :
- 200 mW
- Supplier Device Package :
- 1760-FCBGA (42.5x42.5)
- Max Operating Temperature :
- 155 °C
- Total RAM Bits :
- 77909197
- Datasheets
- XCVU23P-2FSVJ1760E
FPGAs (Field Programmable Gate Array) + AMD Xilinx + XCVU23P-2FSVJ1760E Overview
AMD Xilinx的XCVU23P-2FSVJ1760E是一款高性能的FPGA，旨在满足现代技术应用中的复杂需求。这款芯片采用1760FCBGA封装，提供了强大的可编程性和灵活性，适用于广泛的行业。无论是数据中心、高速通信还是先进的工业自动化，这款FPGA都具备足够的性能来应对最苛刻的任务。AMD Xilinx的卓越制造工艺确保了这款产品在稳定性和耐用性方面的突出表现，使其成为企业批量采购的理想选择。凭借高度集成的设计和可扩展的架构，XCVU23P-2FSVJ1760E在开发过程中提供了广泛的可能性，是打造创新解决方案的关键组件。
XCVU23P-2FSVJ1760E Features
- 高性能：XCVU23P-2FSVJ1760E具有出色的处理能力，能够满足高负载应用的需求。
- 灵活性：其可编程结构允许用户根据特定需求定制设计。
- 大容量：丰富的逻辑单元和存储资源，适合复杂的电路和系统设计。
- 高稳定性：AMD Xilinx的制造工艺确保了可靠性和持久性能。
XCVU23P-2FSVJ1760E Applications
- 数据中心：在数据处理和云计算环境中，这款FPGA可以用于高性能计算和数据加速。
- 高速通信：适用于高带宽通信设备，确保数据传输的稳定性和高速性。
- 工业自动化：在复杂的工业控制和自动化系统中，提供灵活的控制和处理能力。
- 人工智能与机器学习：在AI和ML模型的硬件加速中，这款FPGA可以提供出色的计算性能。
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