XCVU23P-1VSVA1365I
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- Mfr.Part #
- XCVU23P-1VSVA1365I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1365-BFBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA VIRTEX-UP 1365FCBGA
- Stock
- 17,654
- In Stock ：
- 17,654
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Logic Elements/Cells :
- 2252250
- Termination Post Length :
- 0.150 (3.81mm)
- Contact Finish - Mating :
- Tin
- Contact Finish Thickness - Post :
- 50.0µin (1.27µm)
- Mounting Type :
- Through Hole
- Termination :
- Solder
- Contact Material - Post :
- Phosphor Bronze
- Number of Positions or Pins (Grid) :
- 36 (1 x 36)
- Contact Finish - Post :
- Tin
- Contact Material - Mating :
- Phosphor Bronze
- Total RAM Bits :
- 77909197
- Package :
- Tray
- Series :
- 511
- Pitch - Mating :
- 0.100 (2.54mm)
- Supplier Device Package :
- 1365-FCBGA (35x35)
- Type :
- SIP
- Voltage - Supply :
- 0.825V ~ 0.876V
- Packaging :
- Bulk
- Package / Case :
- 1365-BFBGA, FCBGA
- Number of LABs/CLBs :
- 128700
- Product Status :
- Active
- Housing Material :
- Polyamide (PA46), Nylon 4/6, Glass Filled
- Material Flammability Rating :
- UL94 V-0
- Number of I/O :
- 364
- Features :
- --
- Pitch - Post :
- 0.100 (2.54mm)
- Current Rating :
- 1A
- Operating Temperature :
- -55°C ~ 105°C
- Contact Resistance :
- --
- Contact Finish Thickness - Mating :
- 50.0µin (1.27µm)
- Datasheets
- XCVU23P-1VSVA1365I
FPGAs AMD Xilinx XCVU23P-1VSVA1365I Overview
The FPGAs AMD Xilinx XCVU23P-1VSVA1365I represents a pivotal advancement in field-programmable gate array technology, offering a robust solution tailored for sophisticated digital processing tasks. Manufactured by the renowned AMD Xilinx, this IC FPGA VIRTEXUP device is housed in a 1365FCBGA package, designed to meet the rigorous demands of high-performance computing environments. Engineered to support complex logic operations, this FPGA excels in delivering high-speed data processing and versatility, making it ideal for developers looking to push the boundaries of technology in their applications. With its advanced features and capabilities, the XCVU23P-1VSVA1365I is perfectly suited for industries requiring optimal reliability and scalability in their hardware solutions.
XCVU23P-1VSVA1365I Features
The XCVU23P-1VSVA1365I FPGA includes several distinctive features that make it a top choice for high-end applications. These include a highly configurable logic architecture, advanced memory technology, and high-speed serial connectivity options. Its integration capabilities with multiple protocols ensure that it can be adapted to a wide range of industrial applications, while its enhanced security features provide reliable protection against a variety of operational threats.
XCVU23P-1VSVA1365I Applications
- Data Centers: Utilizes its high processing power and connectivity to manage and streamline massive data flows, enhancing data processing and storage operations.
- Telecommunications: Serves as the core technology in telecom equipment, facilitating rapid data transmission and signal processing to meet the needs of modern communication networks.
- Aerospace and Defense: Employs its robust security features and high reliability in critical aerospace and defense applications, ensuring mission-critical tasks are executed flawlessly.
- Medical Imaging: Takes advantage of its high-speed processing capabilities to handle complex algorithms needed for real-time medical imaging and diagnostics.
- Automotive: Supports advanced driver-assistance systems (ADAS) by processing multiple inputs from various sensors, improving vehicle safety and performance.
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