XCVU19P-2FSVB3824E

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Mfr.Part #
XCVU19P-2FSVB3824E
Manufacturer
AMD Xilinx
Package / Case
3824-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA VIRTEX-UP 3824FCBGA
Stock
40,846
In Stock :
40,846

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
Series :
Virtex® UltraScale+™
Number of I/O :
1760
Total RAM Bits :
79586918
Package / Case :
3824-BBGA, FCBGA
Number of LABs/CLBs :
510720
Supplier Device Package :
3824-FCBGA (65x65)
Package :
Tray
Operating Temperature :
0°C ~ 100°C (TJ)
Number of Logic Elements/Cells :
8937600
Voltage - Supply :
0.825V ~ 0.876V
Product Status :
Active
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU19P-2FSVB3824E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:3824-BBGA, FCBGA, Operating Temperature:0°C ~ 100°C (TJ), XCVU19P-2FSVB3824E pinout, XCVU19P-2FSVB3824E datasheet PDF, XCVU19P-2FSVB3824E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU19P-2FSVB3824E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCVU19P-2FSVB3824E


FPGAs AMD Xilinx XCVU19P-2FSVB3824E Overview

The FPGAs AMD Xilinx XCVU19P-2FSVB3824E is a highly advanced field-programmable gate array (FPGA) designed to meet the demanding needs of modern data processing and high-speed communications. Manufactured by AMD Xilinx, this IC integrates a robust feature set into a 3824-pin flip-chip ball grid array (FCBGA) package, ensuring high-density integration and superior performance. This FPGA is particularly suited for applications requiring intense parallel processing and high bandwidth, providing a flexible and efficient solution for system design. The flexibility offered by the reprogrammable logic, combined with high-speed transceivers, makes it an ideal choice for complex digital processing tasks in a variety of industrial settings.

XCVU19P-2FSVB3824E Features

The XCVU19P-2FSVB3824E FPGA from AMD Xilinx offers several distinctive features that make it a top choice for developers and engineers:

  • Advanced 7 nm technology providing high performance and low power consumption.
  • Integrated high-speed transceivers capable of supporting multi-gigabit routing and data transmission.
  • Extensive logic density that allows for the implementation of complex algorithms and functions within a single chip.
  • Superior configurability and reprogrammability to adapt to new standards and protocols.
  • Support for high-speed DSP slices for efficient signal processing.

XCVU19P-2FSVB3824E Applications

  • Data Centers: Utilized for accelerating compute-intensive applications such as virtualization, cloud computing, and big data analytics. The high-speed DSP slices and logic density of the XCVU19P-2FSVB3824E enable efficient processing and throughput.
  • 5G Infrastructure: Critical in the development and deployment of 5G technology, where high-speed data transmission and low latency are paramount. The FPGA's capability to handle high-bandwidth and real-time data processing makes it essential for 5G base stations and network management.
  • Video Processing: Ideal for high-resolution video processing applications, including real-time video editing and broadcasting. Its ability to rapidly process large data sets ensures seamless video quality and performance.
  • Automotive: Used in advanced driver-assistance systems (ADAS) and autonomous vehicle systems, where quick data processing and decision-making are critical. The FPGA's robust processing capabilities help manage sensor data and control decisions in real time.
  • Aerospace and Defense: Employs in mission-critical aerospace applications such as satellite communications and radar systems. The FPGA's high reliability and reconfigurability suit the dynamic and demanding requirements of aerospace applications.
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