XCVU19P-2FSVA3824E
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- Mfr.Part #
- XCVU19P-2FSVA3824E
- Manufacturer
- AMD Xilinx
- Package / Case
- FBGA-3824
- Datasheet
- Download
- Description
- IC FPGA 1976 I/O 3824FCBGA
- Stock
- 11,604
- In Stock ：
- 11,604
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 0.825V ~ 0.876V
- Manufacturer :
- Xilinx
- Package / Case :
- FBGA-3824
- Moisture Sensitivity Level (MSL) :
- --
- Operating Temperature :
- 0 C ~ + 100 C
- Brand :
- Xilinx
- Operating Supply Voltage :
- 850 mV
- Maximum Operating Temperature :
- + 100 C
- Subcategory :
- Programmable Logic ICs
- Number of Transceivers :
- 48 Transceiver
- RoHS :
- Details
- Product Type :
- FPGA - Field Programmable Gate Array
- Data Rate :
- 32.75 Gb/s
- Base Part Number :
- XCVU19
- Number of I/O :
- 1976
- Number of I/Os :
- 2072 I/O
- Tradename :
- Virtex UltraScale+
- Number of Logic Elements/Cells :
- 8937600
- Number of Gates :
- --
- Product Category :
- FPGA - Field Programmable Gate Array
- Minimum Operating Temperature :
- 0 C
- Mounting Style :
- SMD/SMT
- Series :
- XCVU19P
- Number of LABs/CLBs :
- 510720
- Total RAM Bits :
- 79586918
- Supplier Device Package :
- 3824-FCBGA (65x65)
- Datasheets
- XCVU19P-2FSVA3824E
FPGAs AMD Xilinx XCVU19P-2FSVA3824E Overview
Introducing the advanced FPGAs AMD Xilinx XCVU19P-2FSVA3824E, a leading-edge field programmable gate array (FPGA) designed to cater to demanding computational needs across various sectors. Manufactured by AMD Xilinx, this FPGA stands out for its substantial I/O capacity and high-performance capabilities housed in a 3824FCBGA package. Ideal for applications requiring high-speed data processing and multifunctional integration, the XCVU19P-2FSVA3824E offers unparalleled flexibility and performance optimization in a compact form factor.
XCVU19P-2FSVA3824E Features
The XCVU19P-2FSVA3824E FPGA is equipped with 1976 I/O pins, providing extensive connectivity options for a wide range of applications. Its 3824-pin flip-chip ball grid array (FCBGA) package ensures robust physical connections and improved heat dissipation, making it suitable for intensive operations. This device is designed to support complex digital processing tasks, offering a versatile platform for customization according to specific project requirements.
XCVU19P-2FSVA3824E Applications
- Data Centers: Utilized for accelerating computing tasks, managing vast data throughput, and optimizing storage solutions.
- Telecommunications: Critical in handling high-speed signal processing, infrastructure management, and network traffic optimization.
- Aerospace and Defense: Employs robust FPGA technology for navigation systems, on-board systems management, and communication infrastructures.
- Automotive: Integrates into driver assistance systems, infotainment, and vehicle-to-everything (V2X) communications.
- Medical Imaging: Applied in complex imaging equipment like MRIs and CT scanners for faster data processing and enhanced image resolution.
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