XCVU190-3FLGB2104E
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- Mfr.Part #
- XCVU190-3FLGB2104E
- Manufacturer
- AMD Xilinx
- Package / Case
- 2104-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 702 I/O 2104FCBGA
- Stock
- 17,019
- In Stock ：
- 17,019
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of CLBs :
- 1800
- Total RAM Bits :
- 150937600
- Number of LABs/CLBs :
- 134280
- Package / Case :
- 2104-BBGA, FCBGA
- Terminal Position :
- BOTTOM
- Operating Temperature :
- 0°C~100°C TJ
- Packaging :
- Tray
- Published :
- 2013
- Number of Logic Elements/Cells :
- 2349900
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- HTS Code :
- 8542.39.00.01
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Surface Mount :
- yes
- Factory Lead Time :
- 10 Weeks
- Number of I/O :
- 702
- Supply Voltage :
- 1V
- ECCN Code :
- 3A001.A.7.B
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Series :
- Virtex® UltraScale™
- Terminal Form :
- Ball
- Voltage - Supply :
- 0.970V~1.030V
- JESD-609 Code :
- e1
- Reach Compliance Code :
- not_compliant
- Organization :
- 1800 CLBS
- RAM Size :
- 16.6MB
- Mounting Type :
- Surface Mount
- JESD-30 Code :
- S-PBGA-B2104
- RoHS Status :
- ROHS3 Compliant
- Datasheets
- XCVU190-3FLGB2104E
FPGAs Virtex® UltraScale™ Series 2104-BBGA, FCBGA
XCVU190-3FLGB2104E Overview
In the 2104-BBGA, FCBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 702 I/O ports for more coherent data transfer. To form a fundamental building block, there are 2349900 logic elements/cells. In order to operate fpga chips, a voltage supply of 1V volts is required. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.970V~1.030V-volt supply voltage required for the device to operate. The Virtex® UltraScale™ Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within 0°C~100°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 150937600 bFpga chipss. It is crucial that the RAM si16.6MBe of this FPGA module reaches 16.6MB so that the program can run normally. A total of 134280 LABs/CLBs are included in this FPGA. For its architecture, 1800 CLB modules are used.
XCVU190-3FLGB2104E Features
702 I/Os
Up to 150937600 RAM bits
XCVU190-3FLGB2104E Applications
There are a lot of Xilinx Inc.
XCVU190-3FLGB2104E FPGAs applications.
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
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