XCVU190-2FLGC2104E
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- Mfr.Part #
- XCVU190-2FLGC2104E
- Manufacturer
- AMD Xilinx
- Package / Case
- 2104-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 416 I/O 2104FCBGA
- Stock
- 26,891
- In Stock ：
- 26,891
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Supply Voltage :
- 0.95V
- Number of Logic Elements/Cells :
- 2349900
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- HTS Code :
- 8542.39.00.01
- Organization :
- 1800 CLBS
- Reach Compliance Code :
- not_compliant
- Terminal Form :
- Ball
- Package / Case :
- 2104-BBGA, FCBGA
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of LABs/CLBs :
- 134280
- Number of CLBs :
- 1800
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Total RAM Bits :
- 150937600
- RAM Size :
- 16.6MB
- Series :
- Virtex® UltraScale™
- Operating Temperature :
- 0°C~100°C TJ
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of I/O :
- 416
- RoHS Status :
- ROHS3 Compliant
- Factory Lead Time :
- 10 Weeks
- Mounting Type :
- Surface Mount
- ECCN Code :
- 3A001.A.7.B
- Voltage - Supply :
- 0.922V~0.979V
- JESD-30 Code :
- S-PBGA-B2104
- Packaging :
- Tray
- Surface Mount :
- yes
- Published :
- 2013
- JESD-609 Code :
- e1
- Datasheets
- XCVU190-2FLGC2104E
FPGAs Virtex® UltraScale™ Series 2104-BBGA, FCBGA
XCVU190-2FLGC2104E Overview
The package that contains this software is called 2104-BBGA, FCBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 416 I/Os for better data transfer. In order to construct a fundamental building block, 2349900 logic elements/cells are required. In order for the device to operate, a supply voltage of 0.95V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 0.922V~0.979V battery. There are many types of FPGAs in the Virtex® UltraScale™ series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 150937600. For the program to work properly, the RAM si16.6MBe of this FPGA module must reach 16.6MB GB in order to ensure normal operation. 134280 LABs/CLBs are configured on this FPGA. An architecture consists of 1800 CLBs.
XCVU190-2FLGC2104E Features
416 I/Os
Up to 150937600 RAM bits
XCVU190-2FLGC2104E Applications
There are a lot of Xilinx Inc.
XCVU190-2FLGC2104E FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
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