XCVU190-2FLGA2577I

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Mfr.Part #
XCVU190-2FLGA2577I
Manufacturer
AMD Xilinx
Package / Case
2577-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 448 I/O 2577FCBGA
Stock
33,370
In Stock :
33,370

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
JESD-30 Code :
S-PBGA-B2577
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Series :
Virtex® UltraScale™
Number of CLBs :
1800
HTS Code :
8542.39.00.01
Packaging :
Tray
Terminal Pitch :
1mm
Height Seated (Max) :
4.01mm
Number of Logic Elements/Cells :
2349900
Operating Temperature :
-40°C~100°C TJ
Supply Voltage :
0.95V
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Package / Case :
2577-BBGA, FCBGA
Organization :
1800 CLBS
ECCN Code :
3A001.A.7.B
Surface Mount :
yes
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
JESD-609 Code :
e1
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
0.922V~0.979V
Terminal Form :
Ball
Number of I/O :
448
Reach Compliance Code :
not_compliant
Terminal Position :
BOTTOM
Width :
52.5mm
Length :
52.5mm
Total RAM Bits :
150937600
Factory Lead Time :
12 Weeks
Number of LABs/CLBs :
134280
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU190-2FLGA2577I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:2577-BBGA, FCBGA, Mounting Type:Surface Mount, XCVU190-2FLGA2577I pinout, XCVU190-2FLGA2577I datasheet PDF, XCVU190-2FLGA2577I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU190-2FLGA2577I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



4.01mm mm FPGAs Virtex® UltraScale™ Series 2577-BBGA, FCBGA 1mm mm

XCVU190-2FLGA2577I Overview


The package that contains this software is called 2577-BBGA, FCBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 448 I/Os for better data transfer. In order to construct a fundamental building block, 2349900 logic elements/cells are required. In order for the device to operate, a supply voltage of 0.95V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 0.922V~0.979V battery. There are many types of FPGAs in the Virtex® UltraScale™ series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 150937600. 134280 LABs/CLBs are configured on this FPGA. An architecture consists of 1800 CLBs.

XCVU190-2FLGA2577I Features


448 I/Os
Up to 150937600 RAM bits


XCVU190-2FLGA2577I Applications


There are a lot of Xilinx Inc.
XCVU190-2FLGA2577I FPGAs applications.


  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
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