XCVU13P-3FSGA2577E
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- Mfr.Part #
- XCVU13P-3FSGA2577E
- Manufacturer
- AMD Xilinx
- Package / Case
- 2577-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 448 I/O 2577FCBGA
- Stock
- 7,124
- In Stock ：
- 7,124
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- Number of Logic Elements/Cells :
- 3780000
- Total RAM Bits :
- 99090432
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Package / Case :
- 2577-BBGA, FCBGA
- Number of LABs/CLBs :
- 216000
- Operating Temperature :
- 0°C~100°C TJ
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of I/O :
- 448
- Voltage - Supply :
- 0.873V~0.927V
- Factory Lead Time :
- 11 Weeks
- Series :
- Virtex® UltraScale+™
- RoHS Status :
- ROHS3 Compliant
- Datasheets
- XCVU13P-3FSGA2577E
FPGAs Virtex® UltraScale+™ Series 2577-BBGA, FCBGA
XCVU13P-3FSGA2577E Overview
A 2577-BBGA, FCBGA package contains it, and it is available for download. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Its 448 I/Os help it transfer data more efficiently. A fundamental building block contains 3780000 logic elements or cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 0.873V~0.927V and uses a battery to supply power. FPGAs belonging to the Virtex® UltraScale+™ series are a type of FPGA that belong to the Virtex® UltraScale+™ series of FPGAs. Operating temperatures should be maintained within the 0°C~100°C TJ range at all times when the unit is in use. Having a RAM bit size of 99090432 means that this device will offer you a lot of memory. 216000 LABs/CLBs are integrated into this FPGA.
XCVU13P-3FSGA2577E Features
448 I/Os
Up to 99090432 RAM bits
XCVU13P-3FSGA2577E Applications
There are a lot of Xilinx Inc.
XCVU13P-3FSGA2577E FPGAs applications.
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
- Distributed Monetary Systems
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