XCVU13P-3FLGA2577E

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Mfr.Part #
XCVU13P-3FLGA2577E
Manufacturer
AMD Xilinx
Package / Case
2577-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 448 I/O 2577FCBGA
Stock
1,135
In Stock :
1,135

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Package / Case :
2577-BBGA, FCBGA
Number of LABs/CLBs :
216000
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Total RAM Bits :
514867200
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
ROHS3 Compliant
Number of Logic Elements/Cells :
3780000
Packaging :
Tray
Voltage - Supply :
0.873V~0.927V
Series :
Virtex® UltraScale+™
Reach Compliance Code :
not_compliant
HTS Code :
8542.39.00.01
Published :
2013
Number of I/O :
448
Factory Lead Time :
11 Weeks
Operating Temperature :
0°C~100°C TJ
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU13P-3FLGA2577E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:2577-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, XCVU13P-3FLGA2577E pinout, XCVU13P-3FLGA2577E datasheet PDF, XCVU13P-3FLGA2577E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU13P-3FLGA2577E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2577-BBGA, FCBGA

XCVU13P-3FLGA2577E Overview


There is a 2577-BBGA, FCBGA package that includes this component. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. 448 I/Os are available for transferring data more efficiently. A fundamental building block consists of 3780000 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 0.873V~0.927V is needed in order for fpga chips to operate. As part of the Virtex® UltraScale+™ series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~100°C TJ. As a space-saving measure, this FPGA model is contained within Tray. There are 514867200 RAM bits that are available with this device. 216000 LABs and CLBs are built into this FPGA.

XCVU13P-3FLGA2577E Features


448 I/Os
Up to 514867200 RAM bits


XCVU13P-3FLGA2577E Applications


There are a lot of Xilinx Inc.
XCVU13P-3FLGA2577E FPGAs applications.


  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
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