XCVU13P-3FIGD2104E

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Mfr.Part #
XCVU13P-3FIGD2104E
Manufacturer
AMD Xilinx
Package / Case
2104-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 676 I/O 2104FCBGA
Stock
17,702
In Stock :
17,702

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Factory Lead Time :
11 Weeks
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Package / Case :
2104-BBGA, FCBGA
Number of LABs/CLBs :
216000
Voltage - Supply :
0.873V~0.927V
Total RAM Bits :
514867200
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
0°C~100°C TJ
Packaging :
Tray
Number of I/O :
676
Number of Logic Elements/Cells :
3780000
Series :
Virtex® UltraScale+™
Published :
2013
RoHS Status :
ROHS3 Compliant
Reach Compliance Code :
not_compliant
HTS Code :
8542.39.00.01
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU13P-3FIGD2104E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:2104-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, XCVU13P-3FIGD2104E pinout, XCVU13P-3FIGD2104E datasheet PDF, XCVU13P-3FIGD2104E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU13P-3FIGD2104E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA

XCVU13P-3FIGD2104E Overview


Fpga chips is supplied in the 2104-BBGA, FCBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 676 I/Os for transferring data in a more coherent manner. There are 3780000 logic elements/cells to form a fundamental building block. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 0.873V~0.927V. It is a type of FPGA belonging to the Virtex® UltraScale+™ seies. The operating temperature should be kept at 0°C~100°C TJ when operating. This FPGA model is contained in Tray for space saving. The RAM bits that this device offer is 514867200. This FPGA is built as an array of 216000 LABs/CLBs.

XCVU13P-3FIGD2104E Features


676 I/Os
Up to 514867200 RAM bits


XCVU13P-3FIGD2104E Applications


There are a lot of Xilinx Inc.
XCVU13P-3FIGD2104E FPGAs applications.


  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
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