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  6. XCVU13P-2FHGB2104I
XCVU13P-2FHGB2104I

XCVU13P-2FHGB2104I

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Mfr.Part #
XCVU13P-2FHGB2104I
Manufacturer
AMD Xilinx
Package / Case
2104-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 702 I/O 2104FCBGA
Stock
16
In Stock ：
16

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Packaging :
Tray
HTS Code :
8542.39.00.01
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Factory Lead Time :
11 Weeks
Operating Temperature :
-40°C~100°C TJ
Reach Compliance Code :
not_compliant
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Total RAM Bits :
514867200
RAM Size :
11.8MB
Mounting Type :
Surface Mount
Number of I/O :
702
Voltage - Supply :
0.825V~0.876V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Package / Case :
2104-BBGA, FCBGA
Series :
Virtex® UltraScale+™
Number of LABs/CLBs :
216000
Number of Logic Elements/Cells :
3780000
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU13P-2FHGB2104I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C~100°C TJ, Mounting Type：Surface Mount, Package / Case：2104-BBGA, FCBGA, XCVU13P-2FHGB2104I pinout, XCVU13P-2FHGB2104I datasheet PDF, XCVU13P-2FHGB2104I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU13P-2FHGB2104I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA

XCVU13P-2FHGB2104I Overview


This package is included in the 2104-BBGA, FCBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 0.825V~0.876V . An FPGA belonging to the Virtex® UltraScale+™ series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 514867200 RAM bits in terms of its RAM si514867200e. During the configuration of this FPGA module, the RAM si11.8MBe reaches 11.8MB to ensure that the program runs normally. An array of 216000 LABs/CLBs is built into the FPGA.

XCVU13P-2FHGB2104I Features


702 I/Os
Up to 514867200 RAM bits


XCVU13P-2FHGB2104I Applications


There are a lot of Xilinx Inc.
XCVU13P-2FHGB2104I FPGAs applications.


  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
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