XCVU13P-2FHGB2104E

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Mfr.Part #
XCVU13P-2FHGB2104E
Manufacturer
AMD Xilinx
Package / Case
2104-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 702 I/O 2104FCBGA
Stock
47,942
In Stock :
47,942

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Package / Case :
2104-BBGA, FCBGA
Factory Lead Time :
11 Weeks
HTS Code :
8542.39.00.01
Number of I/O :
702
Number of LABs/CLBs :
216000
Reach Compliance Code :
not_compliant
RAM Size :
11.8MB
Operating Temperature :
0°C~100°C TJ
Voltage - Supply :
0.825V~0.876V
Packaging :
Tray
JESD-609 Code :
e1
Series :
Virtex® UltraScale+™
Number of Logic Elements/Cells :
3780000
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Total RAM Bits :
514867200
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU13P-2FHGB2104E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:2104-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, Mounting Type:Surface Mount, XCVU13P-2FHGB2104E pinout, XCVU13P-2FHGB2104E datasheet PDF, XCVU13P-2FHGB2104E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU13P-2FHGB2104E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA

XCVU13P-2FHGB2104E Description


XCVU13P-2FHGB2104E is an FPGA - Field Programmable Gate Array. Xilinx® UltraScale™ architecture comprises high-performance FPGA, MPSoC, and RFSoC families that address a vast spectrum of system requirements, focusing on lowering total power consumption through numerous innovative technological advancements. Some Zynq UltraScale+ RFSoCs include highly flexible soft decision FEC blocks for decoding and encoding data to control errors in data transmission over unreliable or noisy communication channels. The SD-FEC blocks support low-density parity check (LDPC) decode/encode and Turbo decoding for use in 5G wireless, backhaul, DOCSIS, and LTE applications. 



XCVU13P-2FHGB2104E Features


Number of Logic Elements: 3780000 LE

Number of I/Os: 778 I/O

Supply Voltage: 850 mV

Operating Temperature: 0 C to 100 C

Package / Case: FBGA-2104

Using Supply Voltage: 850 mV



XCVU13P-2FHGB2104E Applications


Industrial 

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Enterprise systems 

Datacenter & enterprise computing 

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