XCVU13P-2FHGA2104I

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Mfr.Part #
XCVU13P-2FHGA2104I
Manufacturer
AMD Xilinx
Package / Case
2104-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 832 I/O 2104FCBGA
Stock
32,441
In Stock :
32,441

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Reach Compliance Code :
not_compliant
Number of I/O :
832
Package / Case :
2104-BBGA, FCBGA
Voltage - Supply :
0.825V~0.876V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Total RAM Bits :
514867200
Factory Lead Time :
11 Weeks
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Mounting Type :
Surface Mount
Operating Temperature :
-40°C~100°C TJ
RoHS Status :
ROHS3 Compliant
Number of LABs/CLBs :
216000
Published :
2013
HTS Code :
8542.39.00.01
Series :
Virtex® UltraScale+™
Number of Logic Elements/Cells :
3780000
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU13P-2FHGA2104I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:2104-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, XCVU13P-2FHGA2104I pinout, XCVU13P-2FHGA2104I datasheet PDF, XCVU13P-2FHGA2104I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU13P-2FHGA2104I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA

XCVU13P-2FHGA2104I Overview


This package is included in the 2104-BBGA, FCBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 0.825V~0.876V . An FPGA belonging to the Virtex® UltraScale+™ series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 514867200 RAM bits in terms of its RAM si514867200e. An array of 216000 LABs/CLBs is built into the FPGA.

XCVU13P-2FHGA2104I Features


832 I/Os
Up to 514867200 RAM bits


XCVU13P-2FHGA2104I Applications


There are a lot of Xilinx Inc.
XCVU13P-2FHGA2104I FPGAs applications.


  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
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