XCVU13P-1FHGB2104E

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Mfr.Part #
XCVU13P-1FHGB2104E
Manufacturer
AMD Xilinx
Package / Case
2104-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 702 I/O 2104FCBGA
Stock
21,606
In Stock :
21,606

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of LABs/CLBs :
216000
Factory Lead Time :
11 Weeks
Series :
Virtex® UltraScale+™
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RAM Size :
11.8MB
Operating Temperature :
0°C~100°C TJ
HTS Code :
8542.39.00.01
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Reach Compliance Code :
not_compliant
Number of Logic Elements/Cells :
3780000
Voltage - Supply :
0.825V~0.876V
Package / Case :
2104-BBGA, FCBGA
Packaging :
Tray
Total RAM Bits :
514867200
Number of I/O :
702
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU13P-1FHGB2104E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, Package / Case:2104-BBGA, FCBGA, XCVU13P-1FHGB2104E pinout, XCVU13P-1FHGB2104E datasheet PDF, XCVU13P-1FHGB2104E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU13P-1FHGB2104E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA

XCVU13P-1FHGB2104E Overview


As part of the 2104-BBGA, FCBGA package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 702 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 3780000 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 0.825V~0.876V . It is a type of FPGA that belongs to the Virtex® UltraScale+™ series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. In order to save space, this FPGA model has been contained in Tray. This device has 514867200 RAM bits, which is the number of RAM bits that this device offers. Fpga electronics is important that this FPGA module has a RAM si11.8MBe of 11.8MB in order to ensure that the program will run normally. The FPGA consists of 216000 LABs/CLBs.

XCVU13P-1FHGB2104E Features


702 I/Os
Up to 514867200 RAM bits


XCVU13P-1FHGB2104E Applications


There are a lot of Xilinx Inc.
XCVU13P-1FHGB2104E FPGAs applications.


  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
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