XCVU11P-3FLGC2104E

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Mfr.Part #
XCVU11P-3FLGC2104E
Manufacturer
AMD Xilinx
Package / Case
2104-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 416 I/O 2104FCBGA
Stock
19,115
In Stock :
19,115

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of I/O :
416
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Series :
Virtex® UltraScale+™
Total RAM Bits :
396150400
Voltage - Supply :
0.873V~0.927V
Number of Logic Elements/Cells :
2835000
Reach Compliance Code :
not_compliant
RoHS Status :
ROHS3 Compliant
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
Package / Case :
2104-BBGA, FCBGA
Operating Temperature :
0°C~100°C TJ
Packaging :
Tray
Published :
2013
Number of LABs/CLBs :
162000
Factory Lead Time :
11 Weeks
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU11P-3FLGC2104E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:2104-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, XCVU11P-3FLGC2104E pinout, XCVU11P-3FLGC2104E datasheet PDF, XCVU11P-3FLGC2104E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU11P-3FLGC2104E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA

XCVU11P-3FLGC2104E Overview


Fpga chips is supplied in the 2104-BBGA, FCBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 416 I/Os for transferring data in a more coherent manner. There are 2835000 logic elements/cells to form a fundamental building block. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 0.873V~0.927V. It is a type of FPGA belonging to the Virtex® UltraScale+™ seies. The operating temperature should be kept at 0°C~100°C TJ when operating. This FPGA model is contained in Tray for space saving. The RAM bits that this device offer is 396150400. This FPGA is built as an array of 162000 LABs/CLBs.

XCVU11P-3FLGC2104E Features


416 I/Os
Up to 396150400 RAM bits


XCVU11P-3FLGC2104E Applications


There are a lot of Xilinx Inc.
XCVU11P-3FLGC2104E FPGAs applications.


  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
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