XCVU11P-3FLGB2104E

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Mfr.Part #
XCVU11P-3FLGB2104E
Manufacturer
AMD Xilinx
Package / Case
2104-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 572 I/O 2104FCBGA
Stock
23,882
In Stock :
23,882

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
396150400
Published :
2013
Number of Logic Elements/Cells :
2835000
Packaging :
Tray
Operating Temperature :
0°C~100°C TJ
Mounting Type :
Surface Mount
HTS Code :
8542.39.00.01
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Voltage - Supply :
0.873V~0.927V
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Factory Lead Time :
11 Weeks
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Package / Case :
2104-BBGA, FCBGA
Number of LABs/CLBs :
162000
Series :
Virtex® UltraScale+™
Number of I/O :
572
Reach Compliance Code :
not_compliant
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU11P-3FLGB2104E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Mounting Type:Surface Mount, Package / Case:2104-BBGA, FCBGA, XCVU11P-3FLGB2104E pinout, XCVU11P-3FLGB2104E datasheet PDF, XCVU11P-3FLGB2104E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU11P-3FLGB2104E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA

XCVU11P-3FLGB2104E Overview


A 2104-BBGA, FCBGA package contains it, and it is available for download. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Its 572 I/Os help it transfer data more efficiently. A fundamental building block contains 2835000 logic elements or cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 0.873V~0.927V and uses a battery to supply power. FPGAs belonging to the Virtex® UltraScale+™ series are a type of FPGA that belong to the Virtex® UltraScale+™ series of FPGAs. Operating temperatures should be maintained within the 0°C~100°C TJ range at all times when the unit is in use. A model of this FPGA is contained in Tray for the purpose of saving space. Having a RAM bit size of 396150400 means that this device will offer you a lot of memory. 162000 LABs/CLBs are integrated into this FPGA.

XCVU11P-3FLGB2104E Features


572 I/Os
Up to 396150400 RAM bits


XCVU11P-3FLGB2104E Applications


There are a lot of Xilinx Inc.
XCVU11P-3FLGB2104E FPGAs applications.


  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
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