XCVU11P-3FLGA2577E

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Mfr.Part #
XCVU11P-3FLGA2577E
Manufacturer
AMD Xilinx
Package / Case
2577-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 448 I/O 2577FCBGA
Stock
45,077
In Stock :
45,077

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
Number of LABs/CLBs :
162000
HTS Code :
8542.39.00.01
Operating Temperature :
0°C~100°C TJ
Total RAM Bits :
396150400
Packaging :
Tray
Factory Lead Time :
11 Weeks
Series :
Virtex® UltraScale+™
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
ROHS3 Compliant
Number of I/O :
448
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Reach Compliance Code :
not_compliant
Number of Logic Elements/Cells :
2835000
Published :
2013
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Voltage - Supply :
0.873V~0.927V
Package / Case :
2577-BBGA, FCBGA
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU11P-3FLGA2577E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, Package / Case:2577-BBGA, FCBGA, XCVU11P-3FLGA2577E pinout, XCVU11P-3FLGA2577E datasheet PDF, XCVU11P-3FLGA2577E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU11P-3FLGA2577E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2577-BBGA, FCBGA

XCVU11P-3FLGA2577E Overview


There are two packages that contain fpga chips: 2577-BBGA, FCBGA package and X package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. Having 448 I/Os makes data transfers more coherent. Logic blocks consist of 2835000 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. The supply voltage of the device is 0.873V~0.927V , at which it runs. The Virtex® UltraScale+™ series FPGA is a type of FPGA that belongs to the Virtex® UltraScale+™ family of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~100°C TJ range. There is an FPGA model contained in Tray in order to conserve space. A device like this one offers 396150400 RAM bits, which is a considerable amount of memory. A total of 162000 LABs/CLBs make up this FPGA array.

XCVU11P-3FLGA2577E Features


448 I/Os
Up to 396150400 RAM bits


XCVU11P-3FLGA2577E Applications


There are a lot of Xilinx Inc.
XCVU11P-3FLGA2577E FPGAs applications.


  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
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