XCVU11P-2FLGC2104E

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Mfr.Part #
XCVU11P-2FLGC2104E
Manufacturer
AMD Xilinx
Package / Case
2104-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 416 I/O 2104FCBGA
Stock
24,320
In Stock :
24,320

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Temperature :
0°C~100°C TJ
RoHS Status :
ROHS3 Compliant
HTS Code :
8542.39.00.01
Voltage - Supply :
0.825V~0.876V
Packaging :
Tray
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Package / Case :
2104-BBGA, FCBGA
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of I/O :
416
Number of LABs/CLBs :
162000
Mounting Type :
Surface Mount
Total RAM Bits :
396150400
Reach Compliance Code :
not_compliant
Published :
2013
Series :
Virtex® UltraScale+™
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Factory Lead Time :
11 Weeks
Number of Logic Elements/Cells :
2835000
JESD-609 Code :
e1
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU11P-2FLGC2104E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Package / Case:2104-BBGA, FCBGA, Mounting Type:Surface Mount, XCVU11P-2FLGC2104E pinout, XCVU11P-2FLGC2104E datasheet PDF, XCVU11P-2FLGC2104E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU11P-2FLGC2104E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2104-BBGA, FCBGA

XCVU11P-2FLGC2104E Overview


The package that contains this software is called 2104-BBGA, FCBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 416 I/Os for better data transfer. In order to construct a fundamental building block, 2835000 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 0.825V~0.876V battery. There are many types of FPGAs in the Virtex® UltraScale+™ series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 396150400. 162000 LABs/CLBs are configured on this FPGA.

XCVU11P-2FLGC2104E Features


416 I/Os
Up to 396150400 RAM bits


XCVU11P-2FLGC2104E Applications


There are a lot of Xilinx Inc.
XCVU11P-2FLGC2104E FPGAs applications.


  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
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