XCVU11P-1FLGA2577I

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Mfr.Part #
XCVU11P-1FLGA2577I
Manufacturer
AMD Xilinx
Package / Case
2577-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 448 I/O 2577FCBGA
Stock
26,965
In Stock :
26,965

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Published :
2013
Factory Lead Time :
11 Weeks
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Package / Case :
2577-BBGA, FCBGA
Reach Compliance Code :
not_compliant
Operating Temperature :
-40°C~100°C TJ
Number of Logic Elements/Cells :
2835000
Number of LABs/CLBs :
162000
RoHS Status :
ROHS3 Compliant
Total RAM Bits :
396150400
Mounting Type :
Surface Mount
Voltage - Supply :
0.825V~0.876V
HTS Code :
8542.39.00.01
Series :
Virtex® UltraScale+™
Number of I/O :
448
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Packaging :
Tray
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU11P-1FLGA2577I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:2577-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, XCVU11P-1FLGA2577I pinout, XCVU11P-1FLGA2577I datasheet PDF, XCVU11P-1FLGA2577I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU11P-1FLGA2577I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2577-BBGA, FCBGA

XCVU11P-1FLGA2577I Overview


As part of the 2577-BBGA, FCBGA package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 448 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 2835000 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 0.825V~0.876V . It is a type of FPGA that belongs to the Virtex® UltraScale+™ series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. In order to save space, this FPGA model has been contained in Tray. This device has 396150400 RAM bits, which is the number of RAM bits that this device offers. The FPGA consists of 162000 LABs/CLBs.

XCVU11P-1FLGA2577I Features


448 I/Os
Up to 396150400 RAM bits


XCVU11P-1FLGA2577I Applications


There are a lot of Xilinx Inc.
XCVU11P-1FLGA2577I FPGAs applications.


  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
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