XCVU11P-1FLGA2577E

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Mfr.Part #
XCVU11P-1FLGA2577E
Manufacturer
AMD Xilinx
Package / Case
2577-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 448 I/O 2577FCBGA
Stock
9,999
In Stock :
9,999

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
396150400
Package / Case :
2577-BBGA, FCBGA
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Operating Temperature :
0°C~100°C TJ
Number of I/O :
448
Number of LABs/CLBs :
162000
Reach Compliance Code :
not_compliant
Number of Logic Elements/Cells :
2835000
Published :
2013
Packaging :
Tray
Voltage - Supply :
0.825V~0.876V
Series :
Virtex® UltraScale+™
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Factory Lead Time :
11 Weeks
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU11P-1FLGA2577E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:2577-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, Mounting Type:Surface Mount, XCVU11P-1FLGA2577E pinout, XCVU11P-1FLGA2577E datasheet PDF, XCVU11P-1FLGA2577E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCVU11P-1FLGA2577E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Virtex® UltraScale+™ Series 2577-BBGA, FCBGA

XCVU11P-1FLGA2577E Overview


As part of the 2577-BBGA, FCBGA package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 448 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 2835000 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 0.825V~0.876V . It is a type of FPGA that belongs to the Virtex® UltraScale+™ series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. In order to save space, this FPGA model has been contained in Tray. This device has 396150400 RAM bits, which is the number of RAM bits that this device offers. The FPGA consists of 162000 LABs/CLBs.

XCVU11P-1FLGA2577E Features


448 I/Os
Up to 396150400 RAM bits


XCVU11P-1FLGA2577E Applications


There are a lot of Xilinx Inc.
XCVU11P-1FLGA2577E FPGAs applications.


  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
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