XCVU095-2FFVD1517E
- Mfr.Part #
- XCVU095-2FFVD1517E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 338 I/O 1517FCBGA
- Stock
- 7,180
- In Stock :
- 7,180
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of LABs/CLBs :
- 67200
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Packaging :
- Bulk
- Supply Voltage :
- 0.95V
- Operating Temperature :
- 0°C~100°C TJ
- Number of CLBs :
- 768
- Factory Lead Time :
- 10 Weeks
- HTS Code :
- 8542.39.00.01
- Series :
- Virtex® UltraScale™
- Length :
- 40mm
- Organization :
- 768 CLBS
- Width :
- 40mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Voltage - Supply :
- 0.922V~0.979V
- JESD-30 Code :
- S-PBGA-B1517
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Terminal Form :
- Ball
- ECCN Code :
- 3A001.A.7.B
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Published :
- 2012
- Height Seated (Max) :
- 3.51mm
- Number of Logic Elements/Cells :
- 1176000
- Total RAM Bits :
- 62259200
- JESD-609 Code :
- e1
- Number of I/O :
- 338
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- RoHS Status :
- ROHS3 Compliant
- Surface Mount :
- yes
- Package / Case :
- 1517-BBGA, FCBGA
- Datasheets
- XCVU095-2FFVD1517E

FPGAs AMD Xilinx XCVU095-2FFVD1517E Overview
The AMD Xilinx XCVU095-2FFVD1517E FPGA is a highly versatile and powerful component designed for advanced digital processing and high-speed interfacing. This FPGA is part of AMD Xilinx's UltraScale series, known for its robust architecture that delivers significant improvements in performance, power efficiency, and functionality. The XCVU095-2FFVD1517E is engineered to meet the demands of high-throughput systems and complex digital logic circuits, making it an ideal choice for designers looking for leading-edge solutions in a compact 1517-pin FCBGA package.
XCVU095-2FFVD1517E Features
The XCVU095-2FFVD1517E FPGA is equipped with 338 I/Os, allowing extensive connectivity options for various system peripherals. Its BGA packaging ensures a reliable connection while minimizing the PCB footprint. This model incorporates advanced clock management tools and DSP slices to increase the FPGA’s ability to handle high-speed signal processing and control applications. With these features, the FPGA provides a balance of power and performance, suitable for both industrial-grade applications and high-end consumer electronics.
XCVU095-2FFVD1517E Applications
- Data Centers: Utilized in server infrastructure to accelerate data processing and storage management, enhancing overall efficiency and throughput.
- Telecommunications: Employed in communication equipment for signal processing, network routing, and bandwidth management, ensuring high-speed data transmission and reliability.
- Automotive: Integrated into driver assistance systems to process real-time sensor data, contributing to safer and smarter vehicle functionalities.
- Medical Imaging: Applied in medical diagnostic equipment to process complex imaging data, providing faster and more accurate diagnostic capabilities.
- Video Processing: Used in video surveillance systems and broadcasting equipment to enable high-resolution video capture, processing, and streaming.
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