XCVU095-2FFVC1517I
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- Mfr.Part #
- XCVU095-2FFVC1517I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 520 I/O 1517FCBGA
- Stock
- 11,818
- In Stock ：
- 11,818
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Package / Case :
- 1517-BBGA, FCBGA
- Terminal Pitch :
- 1mm
- Voltage - Supply :
- 0.922V~0.979V
- JESD-609 Code :
- e1
- Surface Mount :
- yes
- Terminal Form :
- Ball
- HTS Code :
- 8542.39.00.01
- Width :
- 40mm
- Packaging :
- Bulk
- Terminal Position :
- BOTTOM
- Height Seated (Max) :
- 3.51mm
- Length :
- 40mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- ECCN Code :
- 3A001.A.7.B
- Operating Temperature :
- -40°C~100°C TJ
- Number of CLBs :
- 768
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Factory Lead Time :
- 10 Weeks
- Organization :
- 768 CLBS
- Published :
- 2012
- Number of I/O :
- 520
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits :
- 62259200
- Mounting Type :
- Surface Mount
- Series :
- Virtex® UltraScale™
- RoHS Status :
- ROHS3 Compliant
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Supply Voltage :
- 0.95V
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- JESD-30 Code :
- S-PBGA-B1517
- Number of Logic Elements/Cells :
- 1176000
- Number of LABs/CLBs :
- 67200
- Datasheets
- XCVU095-2FFVC1517I
FPGAs AMD Xilinx XCVU095-2FFVC1517I Overview
The FPGAs AMD Xilinx XCVU095-2FFVC1517I is a high-performance integrated circuit from AMD Xilinx, designed to meet the complex computational needs and flexibility that modern technology demands. This FPGA, housed in a 1517-pin FCBGA (flip-chip ball grid array) package, provides a robust platform for developing advanced applications requiring high-speed signal processing and intricate logic operations. Its 520 I/O options enable vast connectivity and interfacing possibilities, making it an excellent choice for designers looking to push the boundaries of innovation and functionality in their digital and mixed-signal applications.
XCVU095-2FFVC1517I Features
This FPGA model boasts numerous features that enhance its appeal for various high-demand applications. The device's large array of input/output pins supports extensive peripheral and high-speed interfacing, while its flip-chip packaging ensures improved thermal management and reliability under load. Furthermore, the XCVU095-2FFVC1517I supports multiple logic configurations, allowing users to tailor its function according to their specific requirements, enhancing both performance and efficiency.
XCVU095-2FFVC1517I Applications
- Data Centers: Used in server farms for accelerating computing tasks, managing large data flows, and enhancing security protocols.
- Telecommunications: Employs in telecommunications infrastructure for signal processing, network traffic management, and hardware acceleration.
- Automotive: Integral in advanced driver-assistance systems (ADAS) for processing and interpreting sensor data, enhancing vehicle safety and automation.
- Medical Imaging: Utilized in medical imaging devices such as CT scanners and MRI machines, providing the necessary computational power to handle high-resolution image processing.
- Industrial Automation: Drives automation in manufacturing lines, robotics, and real-time control systems, ensuring efficient and reliable operations.
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