XCS30XL-5BG256C
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- Mfr.Part #
- XCS30XL-5BG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BBGA
- Datasheet
- Download
- Description
- IC FPGA 192 I/O 256BGA
- Stock
- 14,887
- In Stock ：
- 14,887
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RoHS Status :
- Non-RoHS Compliant
- Package / Case :
- 256-BBGA
- Terminal Pitch :
- 1.27mm
- Width :
- 27mm
- RAM Size :
- 2.3kB
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Logic Elements/Cells :
- 1368
- Supply Voltage :
- 3.3V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 225
- Number of Registers :
- 1536
- Terminal Form :
- Ball
- Operating Supply Voltage :
- 3.3V
- Number of LABs/CLBs :
- 576
- Number of Logic Cells :
- 576
- Pin Count :
- 256
- Published :
- 1999
- Mounting Type :
- Surface Mount
- ECCN Code :
- EAR99
- Mount :
- Surface Mount
- Number of Terminations :
- 256
- Number of Outputs :
- 196
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Gates :
- 30000
- Operating Temperature :
- 0°C~85°C TJ
- Radiation Hardening :
- No
- Series :
- Spartan®-XL
- Number of Pins :
- 256
- Combinatorial Delay of a CLB-Max :
- 1 ns
- Number of CLBs :
- 576
- Base Part Number :
- XCS30XL
- Number of Equivalent Gates :
- 10000
- Number of I/O :
- 192
- Length :
- 27mm
- Total RAM Bits :
- 18432
- JESD-609 Code :
- e0
- Lead Free :
- Contains Lead
- Terminal Position :
- BOTTOM
- Voltage - Supply :
- 3V~3.6V
- Speed Grade :
- 5
- Datasheets
- XCS30XL-5BG256C
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FPGAs AMD Xilinx XCS30XL-5BG256C Overview
Introducing the FPGAs AMD Xilinx XCS30XL-5BG256C, a robust and flexible field-programmable gate array (FPGA) that is designed to meet the rigorous demands of modern digital applications. This FPGA is manufactured by AMD Xilinx, a leader in digital design and fabrication. The XCS30XL-5BG256C offers a powerful solution for developers looking to harness the potential of programmable logic devices. Featuring a dense, 256-ball grid array (BGA) package, it provides a high I/O pin count which makes it exceptionally suited for complex digital circuits requiring numerous inputs and outputs. This device excels in environments where adaptability and processing power are critical, making it ideal for a broad range of applications from consumer electronics to industrial automation systems.
XCS30XL-5BG256C Features
The XCS30XL-5BG256C FPGA comes equipped with impressive specifications that ensure top performance in a variety of settings. With 192 I/O pins, it allows for extensive connectivity and interfacing options. The 256 BGA packaging ensures a compact form factor while enabling efficient heat dissipation and robust physical integration. Engineered for versatility, it supports various programming and configuration schemes, which facilitates easy integration into existing technology frameworks without the need for extensive redesign.
XCS30XL-5BG256C Applications
- Consumer Electronics: Utilized in devices such as high-definition televisions and gaming consoles, the XCS30XL-5BG256C enhances processing capabilities and enables richer user experiences with its high I/O capacity and flexibility.
- Communications Infrastructure: Essential in routers and switches, this FPGA supports the complex data processing required for managing and directing high-speed data traffic efficiently.
- Automotive Applications: In advanced driver-assistance systems (ADAS), the XCS30XL-5BG256C processes multiple inputs from various sensors to provide real-time response and decision-making support.
- Industrial Automation: The FPGA's adaptability makes it ideal for control systems in manufacturing lines, allowing for real-time process adjustments and higher operational efficiencies.
- Medical Devices: Used in medical imaging systems, such as MRI and ultrasound, it supports the complex algorithms needed for real-time image processing and analysis.
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