XCS30-3PQ208I
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- Mfr.Part #
- XCS30-3PQ208I
- Manufacturer
- AMD Xilinx
- Package / Case
- 208-BFQFP
- Datasheet
- Download
- Description
- IC FPGA 169 I/O 208QFP
- Stock
- 1,467
- In Stock ：
- 1,467
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Equivalent Gates :
- 10000
- Manufacturer Package Identifier :
- XCS30-3PQ208I
- Number of Terminations :
- 208
- Terminal Form :
- Gull wing
- Series :
- Spartan®
- Terminal Pitch :
- 0.5mm
- Lead Free :
- Contains Lead
- Number of LABs/CLBs :
- 576
- Qualification Status :
- Not Qualified
- Number of Logic Elements/Cells :
- 1368
- Number of Logic Cells :
- 576
- Max Junction Temperature (Tj) :
- 100°C
- Length :
- 28mm
- Peak Reflow Temperature (Cel) :
- 225
- Voltage - Supply :
- 4.5V~5.5V
- Mounting Type :
- Surface Mount
- RAM Size :
- 2.3kB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Width :
- 28mm
- Power Supplies :
- 5V
- Package / Case :
- 208-BFQFP
- Base Part Number :
- XCS30
- Terminal Position :
- QUAD
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Supply Voltage :
- 5V
- Frequency :
- 125MHz
- Number of Outputs :
- 196
- Pin Count :
- 208
- Number of CLBs :
- 576
- RoHS Status :
- Non-RoHS Compliant
- Reach Compliance Code :
- Unknown
- Number of Gates :
- 30000
- Total RAM Bits :
- 18432
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of I/O :
- 169
- Height :
- 4.1mm
- Packaging :
- Tray
- Mount :
- Surface Mount
- JESD-609 Code :
- e0
- Combinatorial Delay of a CLB-Max :
- 1.6 ns
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- ECCN Code :
- EAR99
- Propagation Delay :
- 4.5 ns
- Speed Grade :
- 3
- Published :
- 2010
- Number of Pins :
- 208
- Operating Temperature :
- -40°C~100°C TJ
- Datasheets
- XCS30-3PQ208I
FPGAs AMD Xilinx XCS30-3PQ208I Overview
The FPGAs AMD Xilinx XCS30-3PQ208I is a high-performance integrated circuit specifically designed for applications requiring a flexible, high-density programmable logic solution. This FPGA from AMD Xilinx offers a robust platform for designers to innovate across a spectrum of advanced digital systems. With its compact 208QFP package, it provides a scalable architecture, accommodating a wide range of functionalities and complex logic circuits. This device is tailored to meet the rigorous demands of high-speed and complex digital processing, making it an ideal choice for developers looking to leverage versatility and performance in their hardware designs.
XCS30-3PQ208I Features
This FPGA device incorporates 169 user I/O pins, allowing ample connections for various peripherals and interfaces, enhancing its integration capabilities in complex systems. The XCS30-3PQ208I is also characterized by its robustness and adaptability, ensuring efficient performance and reliability across different operational conditions. Its compatibility with the 208-pin Quad Flat Package (QFP) makes it suitable for dense board layouts, optimizing space without compromising functionality.
XCS30-3PQ208I Applications
- Telecommunications: Utilized in communication infrastructure to manage signal processing and data flow efficiently.
- Automotive Systems: Integrated in automotive electronics for controlling vehicle dynamics and enhancing safety features.
- Consumer Electronics: Employed in devices such as smartphones and tablets to manage multiple functions within compact hardware configurations.
- Industrial Automation: Essential in automation systems for processing complex control algorithms and real-time data handling.
- Medical Devices: Key in medical imaging systems, where it processes high volumes of data for precise imaging diagnostics.
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