XCS30-4BG256C
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- Mfr.Part #
- XCS30-4BG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BBGA
- Datasheet
- Download
- Description
- IC FPGA 192 I/O 256BGA
- Stock
- 48,787
- In Stock ：
- 48,787
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Pin Count :
- 256
- Speed Grade :
- 4
- Number of CLBs :
- 576
- Number of I/O :
- 192
- Mount :
- Surface Mount
- Number of Logic Elements/Cells :
- 1368
- Terminal Position :
- BOTTOM
- Clock Frequency :
- 166MHz
- Number of Logic Cells :
- 576
- Number of LABs/CLBs :
- 576
- Lead Free :
- Contains Lead
- Combinatorial Delay of a CLB-Max :
- 1.2 ns
- Terminal Form :
- Ball
- Power Supplies :
- 5V
- Number of Registers :
- 1536
- Operating Supply Voltage :
- 5V
- Height Seated (Max) :
- 2.55mm
- JESD-609 Code :
- e0
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RoHS Status :
- Non-RoHS Compliant
- Length :
- 27mm
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Mounting Type :
- Surface Mount
- Package / Case :
- 256-BBGA
- Width :
- 27mm
- Voltage - Supply :
- 4.75V~5.25V
- Number of Equivalent Gates :
- 10000
- Terminal Pitch :
- 1.27mm
- Total RAM Bits :
- 18432
- Number of Outputs :
- 196
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Series :
- Spartan®
- Base Part Number :
- XCS30
- Number of Gates :
- 30000
- Supply Voltage :
- 5V
- Packaging :
- Tray
- RAM Size :
- 2.3kB
- Operating Temperature :
- 0°C~85°C TJ
- Radiation Hardening :
- No
- Number of Terminations :
- 256
- Number of Pins :
- 256
- Published :
- 1999
- Datasheets
- XCS30-4BG256C
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FPGAs AMD Xilinx XCS30-4BG256C Overview
The AMD Xilinx XCS30-4BG256C FPGA stands as a pivotal component in the world of customizable silicon technology. This advanced FPGA model offers an impressive mix of flexibility, performance, and scalability ideal for meeting critical computing needs across a wide range of applications. Specifically designed to handle complex digital processing tasks, the XCS30-4BG256C ensures a seamless and efficient performance with its generous array of 192 I/O pins and a dense 256 BGA packaging. This makes it an excellent choice for designers seeking a robust platform for developing high-speed and high-density integrated circuits in demanding environments. Integrating the XCS30-4BG256C FPGA into your projects guarantees a solution that is both innovative and future-proof, fulfilling the needs of a variety of advanced electronic applications.
XCS30-4BG256C Features
The XCS30-4BG256C from AMD Xilinx is enriched with several features that set it apart in the FPGA market. Key attributes include:
- High I/O Count: Offers up to 192 input/output pins, facilitating extensive connectivity and interfacing options.
- Dense Packaging: Utilizes a 256-ball grid array (BGA) packaging that supports a compact form factor while enabling robust electrical performance and heat dissipation.
- Configurable Logic Blocks: Contains numerous logic blocks that can be programmed for a variety of digital computing tasks, allowing for highly flexible and customizable circuit designs.
- High Integration Capability: Capable of supporting sophisticated digital functions in a single chip, reducing the need for multiple components and simplifying the design process.
XCS30-4BG256C Applications
- Telecommunications Equipment: The high I/O count and configurable logic make this FPGA ideal for telecommunications infrastructure, such as routers and switchers, where adaptability and processing power are crucial.
- Automotive Electronics: Used in advanced driver-assistance systems (ADAS) where rapid signal processing and reliability are necessary to ensure safety and performance on the road.
- Medical Devices: Suitable for medical imaging systems, like MRI and ultrasound scanners, providing the necessary speed and accuracy for real-time imaging and diagnostics.
- Industrial Automation: Drives complex automation systems, including robotic controls and manufacturing process controllers, where precision and programmability are key to enhancing productivity and efficiency.
- Consumer Electronics: Applied in devices requiring substantial processing capabilities, such as virtual reality systems and smart home devices, to manage multiple user inputs and multimedia processing simultaneously.
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