XCS30-3PQ208C

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Mfr.Part #
XCS30-3PQ208C
Manufacturer
AMD Xilinx
Package / Case
208-BFQFP
Datasheet
Download
Description
IC FPGA 169 I/O 208QFP
Stock
264
In Stock :
264

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of I/O :
169
RAM Size :
2.3kB
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Qualification Status :
Not Qualified
Number of CLBs :
576
Series :
Spartan®
Packaging :
Tray
Reach Compliance Code :
Unknown
Power Supplies :
5V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code :
e0
Number of Outputs :
196
Number of Gates :
30000
Width :
28mm
Lead Free :
Contains Lead
Peak Reflow Temperature (Cel) :
225
Total RAM Bits :
18432
Height Seated (Max) :
4.1mm
Published :
1999
Number of Terminations :
208
Time@Peak Reflow Temperature-Max (s) :
30
Mounting Type :
Surface Mount
Pin Count :
208
Terminal Finish :
Tin/Lead (Sn85Pb15)
Terminal Form :
Gull wing
Supply Voltage :
5V
Package / Case :
208-BFQFP
Mount :
Surface Mount
Number of Logic Elements/Cells :
1368
Clock Frequency :
125MHz
Number of Equivalent Gates :
10000
Length :
28mm
Terminal Position :
QUAD
Base Part Number :
XCS30
Combinatorial Delay of a CLB-Max :
1.6 ns
ECCN Code :
EAR99
Operating Temperature :
0°C~85°C TJ
Terminal Pitch :
0.5mm
Voltage - Supply :
4.75V~5.25V
RoHS Status :
Non-RoHS Compliant
Number of Pins :
208
HTS Code :
8542.39.00.01
Number of Logic Cells :
576
Number of LABs/CLBs :
576
Datasheets
XCS30-3PQ208C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCS30-3PQ208C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:208, Mounting Type:Surface Mount, Package / Case:208-BFQFP, Base Part Number:XCS30, Operating Temperature:0°C~85°C TJ, Number of Pins:208, XCS30-3PQ208C pinout, XCS30-3PQ208C datasheet PDF, XCS30-3PQ208C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCS30-3PQ208C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCS30-3PQ208C


FPGAs AMD Xilinx XCS30-3PQ208C Overview

The FPGAs AMD Xilinx XCS30-3PQ208C represents a sophisticated choice for designers looking for a programmable logic device that balances performance with cost-efficiency. This IC FPGA, enclosed in a 208QFP package, boasts 169 I/O points, making it exceptionally versatile for a multitude of complex digital circuits. It is engineered to meet the demands of high-speed signal processing and control applications where flexibility is as crucial as reliability. This FPGA from AMD Xilinx allows for rapid prototyping and customization, enhancing the product's adaptability to new and evolving technological requirements.

XCS30-3PQ208C Features

The XCS30-3PQ208C FPGA includes several features that make it a robust option for a wide range of applications. Notably, its 208-pin Quad Flat Pack (QFP) makes it suitable for surface-mounted technology, ensuring compact and efficient use of PCB space. The device supports a wide array of design implementations, facilitated by its ample I/O options and configurable logic blocks which offer increased flexibility and scalability in hardware programming.

XCS30-3PQ208C Applications

  • Consumer Electronics: Used in everything from gaming consoles to smart TVs, the XCS30-3PQ208C helps manage complex digital interactions and enhances user experience with high-speed processing capabilities.
  • Automotive Systems: Can be integrated into automotive infotainment systems, providing robust control and interfacing capabilities necessary for advanced vehicle multimedia systems.
  • Telecommunications: Essential for communication equipment, this FPGA aids in handling complex algorithms needed for signal processing and data transmission with reliability and efficiency.
  • Industrial Automation: In industrial settings, the FPGA serves as a critical component for controlling machinery and processes, enabling precise and adaptable operations.
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