XCS30-3TQ144C
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- Mfr.Part #
- XCS30-3TQ144C
- Manufacturer
- AMD Xilinx
- Package / Case
- 144-LQFP
- Datasheet
- Download
- Description
- IC FPGA 113 I/O 144TQFP
- Stock
- 322
- In Stock ：
- 322
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Gates :
- 30000
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Reach Compliance Code :
- not_compliant
- Speed Grade :
- 3
- Number of Outputs :
- 196
- Series :
- Spartan®
- Terminal Form :
- Gull wing
- Number of Pins :
- 144
- Published :
- 1999
- Base Part Number :
- XCS30
- Number of LABs/CLBs :
- 576
- Combinatorial Delay of a CLB-Max :
- 1.6 ns
- Package / Case :
- 144-LQFP
- Number of Terminations :
- 144
- Width :
- 20mm
- Length :
- 20mm
- Height Seated (Max) :
- 1.6mm
- Total RAM Bits :
- 18432
- Pin Count :
- 144
- RAM Size :
- 2.3kB
- Terminal Position :
- QUAD
- Clock Frequency :
- 125MHz
- Voltage - Supply :
- 4.75V~5.25V
- Mount :
- Surface Mount
- Number of Logic Elements/Cells :
- 1368
- Terminal Finish :
- Tin/Lead (Sn85Pb15)
- Number of Logic Cells :
- 576
- Operating Supply Voltage :
- 5V
- Supply Voltage :
- 5V
- Mounting Type :
- Surface Mount
- Terminal Pitch :
- 0.5mm
- ECCN Code :
- EAR99
- Number of Registers :
- 1536
- Peak Reflow Temperature (Cel) :
- 225
- Qualification Status :
- Not Qualified
- Number of I/O :
- 113
- JESD-609 Code :
- e0
- Operating Temperature :
- 0°C~85°C TJ
- Packaging :
- Tray
- RoHS Status :
- Non-RoHS Compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Equivalent Gates :
- 10000
- Lead Free :
- Contains Lead
- Number of CLBs :
- 576
- Power Supplies :
- 5V
- Datasheets
- XCS30-3TQ144C
FPGAs AMD Xilinx XCS30-3TQ144C Overview
The AMD Xilinx XCS30-3TQ144C represents a robust solution in the field of field-programmable gate arrays (FPGAs), designed to deliver exceptional versatility and efficiency in a wide array of industrial applications. Manufactured by AMD Xilinx, a leader in FPGA technology, this device integrates advanced features into its compact 144-TQFP package, making it an ideal choice for developers looking to implement complex logic circuits while maintaining low power consumption and high reliability. The FPGA XCS30-3TQ144C excels in customizability and is perfectly suited for applications requiring specific hardware configurations within tight design timelines. Its use of leading-edge technology enhances system performance by allowing rapid prototyping of digital circuits with a high degree of flexibility.
XCS30-3TQ144C Features
The XCS30-3TQ144C FPGA is equipped with 113 I/O pins, enabling it to manage multiple inputs and outputs simultaneously, which is critical for high-demand applications. The 144TQFP packaging is not only space-efficient but also optimized for scalable designs that require a compact footprint without sacrificing performance. This FPGA supports a wide range of voltage levels, providing great adaptability across different power systems, and its reprogrammable logic gates allow for easy updates and modifications, which is essential for iterative development processes.
XCS30-3TQ144C Applications
- Telecommunications: Utilized in switching and signal processing equipment, the XCS30-3TQ144C enhances performance and flexibility in data handling and transmission.
- Automotive: Critical for driver assistance systems, this FPGA can process multiple sensor inputs to provide real-time responses, enhancing vehicle safety and performance.
- Consumer Electronics: In devices such as high-definition televisions and digital cameras, the FPGA enables fast processing of audio and video signals, ensuring high-quality output.
- Industrial Automation: The XCS30-3TQ144C is crucial in managing control systems and complex operational processes, improving efficiency and reliability in automated manufacturing lines.
- Medical Devices: Used in diagnostic and imaging equipment, it supports intricate signal processing tasks, contributing to faster and more accurate medical analyses.
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