XC7VX485T-3FFG1927E
- Mfr.Part #
- XC7VX485T-3FFG1927E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1924-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1927FCBGA
- Stock
- 44,485
- In Stock :
- 44,485
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Packaging :
- Tray
- Operating Temperature :
- 0°C~100°C TJ
- Number of Logic Elements/Cells :
- 485760
- Published :
- 2010
- Number of I/O :
- 600
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Position :
- BOTTOM
- Package / Case :
- 1924-BBGA, FCBGA
- Operating Supply Voltage :
- 1V
- Number of Terminations :
- 1927
- Pin Count :
- 1927
- Series :
- Virtex®-7 XT
- RAM Size :
- 4.5MB
- Pbfree Code :
- yes
- Factory Lead Time :
- 10 Weeks
- JESD-30 Code :
- S-PBGA-B1927
- Combinatorial Delay of a CLB-Max :
- 0.58 ns
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Clock Frequency :
- 1818MHz
- Power Supplies :
- 11.8V
- HTS Code :
- 8542.39.00.01
- Terminal Form :
- Ball
- Supply Voltage :
- 1V
- Base Part Number :
- XC7VX485T
- Number of Registers :
- 607200
- Speed Grade :
- -3
- JESD-609 Code :
- e1
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Outputs :
- 600
- Height Seated (Max) :
- 3.65mm
- Mounting Type :
- Surface Mount
- Surface Mount :
- yes
- ECCN Code :
- 3A001.A.7.B
- Terminal Pitch :
- 1mm
- Width :
- 45mm
- RoHS Status :
- ROHS3 Compliant
- Number of Inputs :
- 600
- Length :
- 45mm
- Voltage - Supply :
- 0.97V~1.03V
- Total RAM Bits :
- 37969920
- Radiation Hardening :
- No
- Number of LABs/CLBs :
- 37950
- Datasheets
- XC7VX485T-3FFG1927E

FPGAs AMD Xilinx XC7VX485T-3FFG1927E Overview
The FPGAs AMD Xilinx XC7VX485T-3FFG1927E represents a high-performance, adaptable solution tailored to meet the rigorous demands of modern digital circuits. Engineered by AMD Xilinx, a leader in integrated circuit technology, this FPGA (Field Programmable Gate Array) is designed for developers requiring a versatile platform that combines incredible integration and high functionality. With its 1927-pin flip-chip BGA (FCBGA) packaging and extensive input/output capabilities, this device ensures robust performance for complex, high-density applications. The XC7VX485T-3FFG1927E is particularly suited for professionals aiming to push the boundaries of technological innovation in hardware design.
XC7VX485T-3FFG1927E Features
This FPGA boasts an impressive array of features, including 600 I/O options that provide extensive connectivity and flexibility in system design. Its large-scale integration capabilities support sophisticated digital processing functions, which are essential for handling complex algorithms and high-speed data operations. The FCBGA package enhances thermal management and reduces footprint on the PCB, making it an ideal choice for dense circuit designs where space and heat dissipation are critical considerations.
XC7VX485T-3FFG1927E Applications
- Data Centers: Utilized in server infrastructure to accelerate data processing and throughput, improving overall efficiency and response times in high-demand environments.
- Telecommunications: Employed in communication infrastructure to support high-speed signal processing capabilities, essential for 5G rollout and advanced networking systems.
- Automotive: Integral in advanced driver-assistance systems (ADAS) to process multiple inputs from sensors and cameras, enhancing vehicle safety and functionality.
- Medical Imaging: Applied in sophisticated medical devices for faster and more precise imaging processes, crucial in diagnostics and therapeutic equipment.
- Aerospace and Defense: Used in avionics and military hardware for reliable, real-time processing in critical applications, ensuring performance under extreme conditions.
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