XC7V585T-1FFG1157I
- Mfr.Part #
- XC7V585T-1FFG1157I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1156-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1157FCBGA
- Stock
- 21,062
- In Stock :
- 21,062
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- ECCN Code :
- 3A991.D
- Base Part Number :
- XC7V585T
- Voltage - Supply :
- 0.97V~1.03V
- Terminal Form :
- Ball
- RoHS Status :
- ROHS3 Compliant
- Packaging :
- Tray
- Supply Voltage :
- 1V
- Series :
- Virtex®-7 T
- Operating Temperature :
- -40°C~100°C TJ
- Package / Case :
- 1156-BBGA, FCBGA
- JESD-609 Code :
- e1
- Height Seated (Max) :
- 3.35mm
- Power Supplies :
- 11.8V
- Width :
- 35mm
- Number of Logic Elements/Cells :
- 582720
- Number of Terminations :
- 1157
- Clock Frequency :
- 1818MHz
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Qualification Status :
- Not Qualified
- Number of Inputs :
- 600
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Position :
- BOTTOM
- Total RAM Bits :
- 29306880
- Surface Mount :
- yes
- Pbfree Code :
- yes
- HTS Code :
- 8542.39.00.01
- Number of I/O :
- 600
- Published :
- 2010
- Length :
- 35mm
- Number of LABs/CLBs :
- 45525
- Speed Grade :
- -1
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 1mm
- JESD-30 Code :
- S-PBGA-B1157
- Pin Count :
- 1157
- Number of Registers :
- 728400
- Number of Outputs :
- 600
- Combinatorial Delay of a CLB-Max :
- 0.74 ns
- Mounting Type :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Factory Lead Time :
- 10 Weeks
- RAM Size :
- 3.5MB
- Datasheets
- XC7V585T-1FFG1157I

FPGAs AMD Xilinx XC7V585T-1FFG1157I Overview
The AMD Xilinx XC7V585T-1FFG1157I FPGA represents a pinnacle of flexibility and performance in the field of integrated circuits. Designed to cater to a broad array of sophisticated digital applications, this high-density, field-programmable gate array (FPGA) delivers unmatched performance and configurability. Its robust design is encapsulated in a 1157-pin flip-chip ball grid array (FCBGA) package, ensuring reliable connectivity and efficient heat dissipation. The XC7V585T-1FFG1157I is ideally suited for developers looking for a versatile platform to accelerate their hardware design and development cycles, reducing time-to-market for high-performance applications.
XC7V585T-1FFG1157I Features
This particular model features a robust configuration of 600 I/O ports, which provide substantial flexibility and connectivity options for various design requirements. The XC7V585T-1FFG1157I supports advanced digital signal processing, making it ideal for high-speed data manipulation and analysis. Additionally, its inherent programmability allows for rapid prototyping and iterative design, adapting to new or evolving application requirements without the need for extensive hardware redesign.
XC7V585T-1FFG1157I Applications
- Telecommunications: Used in routers, switches, and base stations to manage signal processing tasks efficiently and optimize network traffic flow.
- Data Centers: Serves as the backbone for data storage systems and server accelerators, enhancing data processing speeds and reliability in large-scale operations.
- Automotive: Integral to advanced driver-assistance systems (ADAS) and infotainment systems, providing the necessary computational power and connectivity.
- Aerospace and Defense: Employs robust FPGA capabilities in navigation systems, flight control systems, and secure communications equipment.
- Consumer Electronics: Powers a variety of household and personal devices, enabling complex digital functionalities in compact form factors.
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