XC7V2000T-L2FHG1761E
- Mfr.Part #
- XC7V2000T-L2FHG1761E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 850 I/O 1761FCBGA
- Stock
- 20,225
- In Stock :
- 20,225
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Series :
- Virtex®-7 T
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- RAM Size :
- 5.7MB
- Packaging :
- Tray
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- ECCN Code :
- 3A001.A.7.A
- Number of Terminations :
- 1761
- Published :
- 2010
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Number of Registers :
- 2.4432e+06
- Terminal Position :
- BOTTOM
- Total RAM Bits :
- 47628288
- Number of Outputs :
- 850
- Number of Logic Elements/Cells :
- 1954560
- Number of LABs/CLBs :
- 152700
- Width :
- 45mm
- Number of Inputs :
- 850
- Package / Case :
- 1760-BBGA, FCBGA
- RoHS Status :
- Non-RoHS Compliant
- Operating Temperature :
- 0°C~100°C TJ
- Terminal Pitch :
- 1mm
- JESD-30 Code :
- S-PBGA-B1761
- Mounting Type :
- Surface Mount
- Radiation Hardening :
- No
- Factory Lead Time :
- 10 Weeks
- Operating Supply Voltage :
- 1V
- Base Part Number :
- XC7V2000T
- Voltage - Supply :
- 0.97V~1.03V
- Clock Frequency :
- 1818MHz
- Mount :
- Surface Mount
- Number of I/O :
- 850
- Height Seated (Max) :
- 3.75mm
- Power Supplies :
- 11.8V
- HTS Code :
- 8542.39.00.01
- Length :
- 45mm
- Supply Voltage :
- 1V
- JESD-609 Code :
- e1
- Datasheets
- XC7V2000T-L2FHG1761E

FPGAs AMD Xilinx XC7V2000T-L2FHG1761E Overview
The FPGAs AMD Xilinx XC7V2000T-L2FHG1761E is a highly capable field-programmable gate array designed for advanced system-level integration. Manufactured by AMD Xilinx, this FPGA enables significant versatility through its reprogrammable silicon that allows rapid prototyping and production across various applications. With its large array of 850 I/O and encapsulated in a 1761FCBGA package, this FPGA meets the increasing demands for higher performance and lower power consumption in complex digital circuits, ensuring optimal efficiency and reliability in deployment.
XC7V2000T-L2FHG1761E Features
The XC7V2000T-L2FHG1761E features an impressive configuration, tailored to enhance performance and flexibility. It supports extensive I/O operations with its 850 I/O interfaces, making it ideal for high-density applications. Encased in a 1761-pin flip-chip ball grid array (FCBGA), it offers robust physical integration with enhanced signal integrity and reduced latency, supporting high-speed data transmission and reception.
XC7V2000T-L2FHG1761E Applications
- Data Centers: Used in server farms and storage systems to accelerate data processing and provide scalable, flexible interfacing options.
- Telecommunications: Integrates into communication infrastructure, supporting complex signal processing tasks essential for next-generation wireless communication and network infrastructure.
- Aerospace and Defense: Provides high reliability and performance under extreme conditions, suitable for satellite communications and avionics systems.
- Medical Imaging: Employs in advanced medical imaging equipment like MRI and CT scanners, improving the processing capabilities and image resolution.
- Automotive: Enhances automotive safety and driver assistance systems by providing substantial computing power for real-time decision-making and control.
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