XC7V585T-1FF1761I
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- Mfr.Part #
- XC7V585T-1FF1761I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 850 I/O 1761FCBGA
- Stock
- 24,673
- In Stock ：
- 24,673
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Published :
- 2010
- Packaging :
- Tray
- Mounting Type :
- Surface Mount
- Radiation Hardening :
- No
- Number of Registers :
- 728400
- Base Part Number :
- XC7V585T
- Mount :
- Surface Mount
- Factory Lead Time :
- 13 Weeks
- RoHS Status :
- Non-RoHS Compliant
- Number of Logic Elements/Cells :
- 582720
- Number of Inputs :
- 750
- Terminal Form :
- Ball
- Package / Case :
- 1760-BBGA, FCBGA
- Operating Temperature :
- -40°C~100°C TJ
- Terminal Position :
- BOTTOM
- Number of Outputs :
- 750
- Total RAM Bits :
- 29306880
- Number of I/O :
- 850
- Propagation Delay :
- 120 ps
- RAM Size :
- 3.5MB
- Operating Supply Voltage :
- 1V
- Series :
- Virtex®-7 T
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Voltage - Supply :
- 0.97V~1.03V
- Number of LABs/CLBs :
- 45525
- Speed Grade :
- 1
- Datasheets
- XC7V585T-1FF1761I
FPGAs AMD Xilinx XC7V585T-1FF1761I Overview
Introducing the FPGAs AMD Xilinx XC7V585T-1FF1761I, a high-performance Field Programmable Gate Array (FPGA) designed for advanced applications requiring significant logic, high-speed I/O, and superior reliability. Manufactured by industry leader AMD Xilinx, this IC FPGA is encapsulated in a 1761FCBGA package, offering a robust platform for developers needing expansive I/O options with a total of 850 I/O pins. Ideal for demanding environments, this product supports intensive processing tasks and is optimized for scalability and efficiency, making it a key component for enterprises looking to innovate and enhance technological infrastructure.
XC7V585T-1FF1761I Features
The XC7V585T-1FF1761I stands out with its extensive capabilities suitable for a wide range of industrial applications. Key features include its 850 I/O pins housed in a 1761-pin flip-chip ball grid array (FCBGA) package, which ensures a compact form factor while maintaining high levels of performance and connectivity. This FPGA is designed for thermal efficiency and reduced power consumption, offering enhanced durability and longevity under continuous operation. Furthermore, it supports multiple configuration options, providing flexibility in design and implementation for specialized hardware needs.
XC7V585T-1FF1761I Applications
- Telecommunications Equipment: Utilizes high I/O capabilities for data-intensive applications like routers and switches, enhancing data flow and network reliability.
- Automotive Driver Assistance Systems: Implements critical real-time processing for sensors and actuators in safety-critical vehicle systems, supporting advanced driver-assistance systems (ADAS).
- Medical Imaging: Powers complex imaging systems such as MRI and ultrasound equipment, offering the necessary speed and precision for real-time imaging and diagnostics.
- Industrial Automation: Ideal for control systems in manufacturing processes, improving operational efficiency and precision with adaptable logic integration.
- Aerospace and Defense: Meets rigorous standards for reliability and performance in applications such as satellite communications and avionics systems.
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