XC7V585T-1FF1157I
- Mfr.Part #
- XC7V585T-1FF1157I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1156-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1157FCBGA
- Stock
- 44,725
- In Stock :
- 44,725
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Contact Plating :
- Lead, Tin
- Number of Outputs :
- 600
- Factory Lead Time :
- 11 Weeks
- Number of Inputs :
- 600
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Speed Grade :
- 1
- RoHS Status :
- Non-RoHS Compliant
- Number of Registers :
- 728400
- Number of Logic Elements/Cells :
- 582720
- Propagation Delay :
- 120 ps
- Terminal Position :
- BOTTOM
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Packaging :
- Tray
- Published :
- 2010
- Number of LABs/CLBs :
- 45525
- Operating Temperature :
- -40°C~100°C TJ
- Series :
- Virtex®-7 T
- Radiation Hardening :
- No
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Package / Case :
- 1156-BBGA, FCBGA
- Total RAM Bits :
- 29306880
- Terminal Form :
- Ball
- Turn On Delay Time :
- 120 ps
- RAM Size :
- 3.5MB
- Voltage - Supply :
- 0.97V~1.03V
- Base Part Number :
- XC7V585T
- Number of I/O :
- 600
- Datasheets
- XC7V585T-1FF1157I

FPGAs AMD Xilinx XC7V585T-1FF1157I Overview
The AMD Xilinx XC7V585T-1FF1157I, part of the renowned FPGAs (Field Programmable Gate Array) category, represents a pinnacle in programmable technology, designed to meet the rigorous demands of high-speed digital processing. This FPGA is crafted to deliver exceptional performance, versatility, and reliability, making it an ideal choice for designers looking to push the boundaries of technology in a variety of applications. With its advanced features and robust 1157FCBGA packaging, the XC7V585T-1FF1157I is tailored for complex digital circuits requiring rapid prototyping and scalable integration, ensuring optimal design flexibility and system efficiency.
XC7V585T-1FF1157I Features
The XC7V585T-1FF1157I FPGA boasts a comprehensive suite of features, including 600 user I/O pins that provide extensive connectivity options. Its integration in a 1157-pin flip-chip ball grid array (FCBGA) package allows for superior power management and heat dissipation, enhancing system reliability under continuous operation. This FPGA supports a wide range of configuration options, ensuring that it can be tailored to specific needs and functionalities in real-time applications.
XC7V585T-1FF1157I Applications
- Telecommunications Infrastructure: Utilized in routers, switches, and base stations to handle complex signal processing tasks, ensuring fast data transfer and improved signal integrity.
- Data Centers: Acts as a processing hub within servers for accelerated data processing and high-speed data throughput, supporting cloud computing and large-scale virtualization environments.
- Automotive: Integrated in driver assistance systems to process and relay real-time sensory and imaging data, contributing to safer driving technologies and enhanced vehicle automation.
- Industrial Automation: Employed in control systems to manage and monitor automated processes, improving operational efficiency and precision in manufacturing plants.
- Consumer Electronics: Used in high-performance home entertainment systems, such as gaming consoles and streaming devices, to enhance graphic and processing capabilities.
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