XC7V585T-1FF1157I

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Mfr.Part #
XC7V585T-1FF1157I
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 1157FCBGA
Stock
44,725
In Stock :
44,725

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Contact Plating :
Lead, Tin
Number of Outputs :
600
Factory Lead Time :
11 Weeks
Number of Inputs :
600
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Speed Grade :
1
RoHS Status :
Non-RoHS Compliant
Number of Registers :
728400
Number of Logic Elements/Cells :
582720
Propagation Delay :
120 ps
Terminal Position :
BOTTOM
Mount :
Surface Mount
Mounting Type :
Surface Mount
Packaging :
Tray
Published :
2010
Number of LABs/CLBs :
45525
Operating Temperature :
-40°C~100°C TJ
Series :
Virtex®-7 T
Radiation Hardening :
No
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Package / Case :
1156-BBGA, FCBGA
Total RAM Bits :
29306880
Terminal Form :
Ball
Turn On Delay Time :
120 ps
RAM Size :
3.5MB
Voltage - Supply :
0.97V~1.03V
Base Part Number :
XC7V585T
Number of I/O :
600
Datasheets
XC7V585T-1FF1157I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7V585T-1FF1157I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Package / Case:1156-BBGA, FCBGA, Base Part Number:XC7V585T, XC7V585T-1FF1157I pinout, XC7V585T-1FF1157I datasheet PDF, XC7V585T-1FF1157I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7V585T-1FF1157I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7V585T-1FF1157I


FPGAs AMD Xilinx XC7V585T-1FF1157I Overview

The AMD Xilinx XC7V585T-1FF1157I, part of the renowned FPGAs (Field Programmable Gate Array) category, represents a pinnacle in programmable technology, designed to meet the rigorous demands of high-speed digital processing. This FPGA is crafted to deliver exceptional performance, versatility, and reliability, making it an ideal choice for designers looking to push the boundaries of technology in a variety of applications. With its advanced features and robust 1157FCBGA packaging, the XC7V585T-1FF1157I is tailored for complex digital circuits requiring rapid prototyping and scalable integration, ensuring optimal design flexibility and system efficiency.

XC7V585T-1FF1157I Features

The XC7V585T-1FF1157I FPGA boasts a comprehensive suite of features, including 600 user I/O pins that provide extensive connectivity options. Its integration in a 1157-pin flip-chip ball grid array (FCBGA) package allows for superior power management and heat dissipation, enhancing system reliability under continuous operation. This FPGA supports a wide range of configuration options, ensuring that it can be tailored to specific needs and functionalities in real-time applications.

XC7V585T-1FF1157I Applications

  • Telecommunications Infrastructure: Utilized in routers, switches, and base stations to handle complex signal processing tasks, ensuring fast data transfer and improved signal integrity.
  • Data Centers: Acts as a processing hub within servers for accelerated data processing and high-speed data throughput, supporting cloud computing and large-scale virtualization environments.
  • Automotive: Integrated in driver assistance systems to process and relay real-time sensory and imaging data, contributing to safer driving technologies and enhanced vehicle automation.
  • Industrial Automation: Employed in control systems to manage and monitor automated processes, improving operational efficiency and precision in manufacturing plants.
  • Consumer Electronics: Used in high-performance home entertainment systems, such as gaming consoles and streaming devices, to enhance graphic and processing capabilities.
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