XC7VX415T-1FFG1157I
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- Mfr.Part #
- XC7VX415T-1FFG1157I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1156-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1157FCBGA
- Stock
- 11,191
- In Stock ：
- 11,191
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RAM Size :
- 3.9MB
- Operating Temperature :
- -40°C~100°C TJ
- Terminal Pitch :
- 1mm
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Terminal Position :
- BOTTOM
- Factory Lead Time :
- 10 Weeks
- Number of LABs/CLBs :
- 32200
- Mounting Type :
- Surface Mount
- Pbfree Code :
- yes
- Number of Registers :
- 515200
- Number of Outputs :
- 600
- RoHS Status :
- ROHS3 Compliant
- JESD-609 Code :
- e1
- Qualification Status :
- Not Qualified
- HTS Code :
- 8542.39.00.01
- Width :
- 35mm
- Total RAM Bits :
- 32440320
- Height Seated (Max) :
- 3.35mm
- Combinatorial Delay of a CLB-Max :
- 0.74 ns
- Clock Frequency :
- 1818MHz
- Surface Mount :
- yes
- Power Supplies :
- 11.8V
- Number of I/O :
- 600
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- ECCN Code :
- 3A991.D
- Base Part Number :
- XC7VX415T
- Terminal Form :
- Ball
- Voltage - Supply :
- 0.97V~1.03V
- Packaging :
- Tray
- Published :
- 2010
- Number of Logic Elements/Cells :
- 412160
- Package / Case :
- 1156-BBGA, FCBGA
- Supply Voltage :
- 1V
- Series :
- Virtex®-7 XT
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Pins :
- 1157
- Speed Grade :
- -1
- Length :
- 35mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Datasheets
- XC7VX415T-1FFG1157I
FPGAs AMD Xilinx XC7VX415T-1FFG1157I Overview
The FPGAs AMD Xilinx XC7VX415T-1FFG1157I is a high-performance, field-programmable gate array designed to meet the needs of advanced digital processing in various industries. Manufactured by AMD Xilinx, a leader in integrated circuits technology, this FPGA stands out with its robust configuration options and versatility. Suitable for high-density applications, it supports a wide range of uses from advanced signal processing to system integration. This component, packaged in a 1157-pin flip-chip ball grid array (FCBGA), offers a remarkable 600 I/O options, providing unmatched flexibility and scalability necessary for complex designs and innovations.
XC7VX415T-1FFG1157I Features
The XC7VX415T-1FFG1157I FPGA boasts an array of features designed for robust and flexible performance. It includes a high count of 600 I/O ports, enabling extensive connectivity and interfacing capabilities. Its compact 1157FCBGA package ensures a minimized footprint while maximizing functionality. Additionally, its industrial temperature range rating enhances its reliability in varying environmental conditions, making it an ideal choice for demanding applications.
XC7VX415T-1FFG1157I Applications
- Telecommunications: Utilized in networking hardware for data processing and signal management, enhancing speed and reliability of network infrastructures.
- Automotive: Employs in driver assistance systems (ADAS) and in-vehicle infotainment systems, providing the processing power required for real-time decision making and multimedia processing.
- Data Centers: Serves as the backbone in data storage systems, handling complex algorithms for data integrity and encryption to ensure security and efficiency.
- Industrial Automation: Integrated into control systems for machinery and production lines, optimizing operations through enhanced computing capabilities and I/O flexibility.
- Aerospace: Deployed in avionics for both civilian and military applications, offering robust performance in critical navigation and communication systems.
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